IP Library Granted Patent US 9,829,406
Granted Patent B2
US 9,829,406 · App. 14/854,648 · Granted Nov 28, 2017

Differential capacitive output pressure sensor and method

Inventors: Aaron A Geisberger (Austin, TX); Dubravka Bilic (Scottsdale, AZ); Chad S Dawson (Queen Creek, AZ); Fengyuan Li (Chandler, AZ)
Assignee: NXP USA, Inc.
G01L9/0073
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,829,406
App. No.
14/854,648
Granted
Nov 28, 2017
Kind
B2
Abstract

A differential capacitive output pressure sensor device includes a pressure sensor diaphragm layer comprising a pressure sensing diaphragm portion, a movable electrode on the pressure sensing diaphragm portion, a fixed electrode, and a device layer electrode. The pressure sensor device further includes a device layer including a fixed element connected to the device layer electrode and a movable element connected to the movable electrode. As the pressure changes, the pressure sensing diaphragm portion including the movable electrode and the movable element move. This changes the capacitance between the movable electrode and the fixed element inversely to the change in capacitance between the fixed electrode and the moveable element. Accordingly, a differential capacitive output is provided that has improved linearity with respect to the pressure change and increased sensitivity allowing the change in pressure to be measured readily and accurately.

Claims (39)

1. A differential capacitive output pressure sensor device comprising:

a pressure sensor diaphragm layer comprising:

a pressure sensing diaphragm portion comprising a movable electrode,

a device layer electrode,

an electrically conductive shield plane layer,

a first dielectric layer,

a second dielectric layer, and

an electrode layer; and

a device layer comprising:

a fixed element coupled to the device layer electrode; and

a movable element coupled to the movable electrode.

2. The differential capacitive output pressure sensor device of claim 1 further comprising:

a movable element via physically and electrically connecting the movable element with the movable electrode; and

a fixed element via physically and electrically connecting the fixed element with the device layer electrode.

3. The differential capacitive output pressure sensor device of claim 1 wherein the movable element is movable relative to the fixed element.

4. The differential capacitive output pressure sensor device of claim 1 wherein the pressure sensor diaphragm layer further comprises a fixed electrode.

5. The differential capacitive output pressure sensor device of claim 4 wherein the movable electrode is movable relative to the fixed element and the movable element is movable relative to the fixed electrode, the movable electrode and the movable element being configured to move together.

6. The differential capacitive output pressure sensor device of claim 5 wherein a capacitance between the movable electrode and the fixed element is configured to increase as a capacitance between the movable element and the fixed electrode is configured to decrease.

7. The differential capacitive output pressure sensor device of claim 5 wherein a capacitance between the movable electrode and the fixed element is configured to decrease as a capacitance between the movable element and the fixed electrode is configured to increase.

8. The differential capacitive output pressure sensor device of claim 1 further comprising:

a substrate comprising a pressure sensor port extending to the pressure sensing diaphragm portion.

9. The differential capacitive output pressure sensor device of claim 1 wherein the electrode layer comprises the movable electrode and the device layer electrode.

10. The differential capacitive output pressure sensor device of claim 1 wherein the electrode layer comprises electrically conductive polysilicon.

11. The differential capacitive output pressure sensor device of claim 1 wherein the device layer comprises single crystal silicon.

12. The differential capacitive output pressure sensor device of claim 1 further comprising a capping layer defining a cavity, the fixed element and the movable element being within the cavity.

13. A method comprising:

forming a pressure sensing diaphragm layer comprising

an electrically conductive shield plane layer,

a first dielectric layer,

a second dielectric layer, and

an electrode layer, the electrode layer comprising a movable electrode on a pressure sensing diaphragm portion of the pressure sensing diaphragm layer, a fixed electrode, and a device layer electrode;

forming a movable element and fixed element in a device layer;

coupling the movable element to the movable electrode and the fixed element to the device layer electrode, the movable element being configured to move relative to the fixed element.

14. The method of claim 13 further comprising measuring a pressure comprising:

measuring a capacitance between the movable electrode and the fixed element; and

measuring a capacitance between the fixed electrode and the movable element.

15. The method of claim 13 wherein the coupling comprises:

physically and electrically connecting the movable element with the movable electrode with a movable element via; and

physically and electrically connecting the fixed element with the device layer electrode with a fixed element via.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040626 FRAME: 0683. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME EFFECTIVE NOVEMBER 7, 2016. Recorded Jan 12, 2017
From: NXP SEMICONDUCTORS USA, INC. (MERGED INTO); FREESCALE SEMICONDUCTOR, INC. (UNDER)
To: NXP USA, INC.
Reel/Frame 041414/0883 →
CHANGE OF NAME Recorded Nov 16, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040626/0683 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 15, 2015
From: GEISBERGER, AARON A; BILIC, DUBRAVKA; DAWSON, CHAD S; LI, FENGYUAN
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 036568/0906 →
Continuity (1)
Related Publication 20170074738A1 · Mar 16, 2017