Patent Assignment
Reel/Frame 075219/0798
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2026-03-23
Received: 2026-03-23
Pages: 41
Assignor
NXP USA, INC.
Executed: 2026-02-02
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
39, CHEMIN DU CHAMP-DES-FILLES, PLAN-LES-OUATES, GENEVA, CHX, 1228, SWITZERLAND
Covered Applications
(10)
DIRECT TIRE PRESSURE MONITORING
App. No. 15/035,291
→
Sensor Protective Coating
App. No. 14/949,869
→
MICROELECTROMECHANICAL SYSTEM DEVICES HAVING THROUGH SUBSTRATE VIAS AND METHODS FOR THE FABRICATION THEREOF
App. No. 14/694,908
→
CAVITY-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF PACKAGING SAME
App. No. 14/527,421
→
Sensor Protective Coating
App. No. 14/069,633
→
REDUCING MICROELECTROMECHANICAL SYSTEMS STICTION BY FORMATION OF A SILICON CARBIDE LAYER
App. No. 13/946,729
→
METHOD OF FABRICATING MEMS DEVICE HAVING RELEASE ETCH STOP LAYER
App. No. 13/868,125
→
SYSTEM AND METHOD FOR IMPROVED MEMS OSCILLATOR STARTUP
App. No. 13/839,079
→
MICROELECTROMECHANICAL SYSTEM DEVICES HAVING THROUGH SUBSTRATE VIAS AND METHODS FOR THE FABRICATION THEREOF
App. No. 13/828,810
→
CAVITY-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF PACKAGING SAME
App. No. 13/478,557
→