IP Library Assignment 075233/0454
Patent Assignment
Reel/Frame 075233/0454

Assignment of Assignor's Interest

Recorded: 2026-07-10 Pages: 4
Assignors
ZHANG, YUN
Executed: 2021-01-25
ZHANG, XINGXING
Executed: 2021-01-25
WOHLFARTH, VOLKER
Executed: 2022-03-05
WANG, JING
Executed: 2021-01-25
DONG, PEIPEI
Executed: 2021-01-25
ZHAO, WEI
Executed: 2021-01-25
Assignees
UMICORE GALVANOTECHNIK GMBH
KLARENBERGSTRASSE 53-79, SCHWAEBISCH GMUEND, 73525, GERMANY
SUZHOU SHINHAO MATERIALS LLC
2358 CHANGAN ROAD, WUJIANG, SUZHOU, JIANGSU, 215200, CHINA
Covered Property (1)
Method of Electroplating Stress-Free Copper Film
Application: 18/737,789 →
Publication: US 2024/0328023
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jul 1, 2026
From: SHINHAO MATERIALS LLC
To: UMICORE (SUZHOU) SEMICONDUCTOR MATERIALS CO. LTD.
Reel/Frame 075150/0135 →