IP Library › Assignment 075578/0586
Patent Assignment
Reel/Frame 075578/0586

Change of Name

Recorded: 2026-04-20 Pages: 16
Assignor
Assignee
YAMAHA ROBOTICS HOLDINGS CO., LTD.
21ST FLOOR, NEW PIER TAKESHIBA SOUTH TOWER, 1-16-1 KAIGAN, MINATO-KU, TOKYO, 105-0022, JAPAN
Covered Property (1)
Bonding Apparatus and Bonding Method
Application: 16/632,879 →
Publication: US US20200388507A1
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 9, 2022
From: SEYAMA, KOHEI; NOGUCHI, YUICHIRO
To: YAMAHA MOTOR ROBOTICS HOLDINGS CO., LTD.
Reel/Frame 060155/0742 →