Warpage preventing substrates
View Patent ↗Consistent with an example embodiment, there is an apparatus comprising a circuit ( 500 ) board. The circuit board includes a first surface ( 501 a ) and a second surface ( 501 b ). The first and second surfaces each have at least a component populated thereon; the circuit board has a first surface thereof populated before a second surface thereof and is overmolded. The circuit board has conductive material disposed over areas of the second surface defining at least a feature ( 504 ) on the second surface. The at least a feature is defined by the conductive material and other than defined by solder resist ( 508 ) disposed on the second surface overlapping the conductive material, wherein the at least a feature is a feature for remaining exposed during a process of populating the first surface other than a fiducial.
1. An apparatus comprising: a circuit board including a first surface and a second surface, the first and second surfaces each for having at least a component populated thereon, the circuit board for having the first surface thereof populated before the second surface thereof and for being overmolded, the circuit board having conductive material disposed directly on and physically contacting the second surface, the conductive material defining at least one feature on the second surface, the at least one feature defined by the conductive material, the circuit board having a solder resist disposed directly on and physically contacting the second surface without overlapping or physically contacting the conductive material, wherein the at least one feature is a feature for remaining exposed during a process of populating the first surface other than a fiducial.
2. The apparatus of claim 1 wherein the at least one feature comprises a heat sink.
3. The apparatus of claim 1 wherein the at least one feature comprises a via.
4. The apparatus of claim 1 wherein on the second surface the solder resist is disposed in substantially a same plane as the conductive features.
5. The apparatus of claim 1 wherein material disposed on the second surface of the board is so disposed in a pattern to prevent warpage of the board during overmolding thereof.
6. The apparatus of claim 1 wherein the second surface has sufficient support along a flat resting plane thereof such that during overmolding the circuit board is other than substantially warped.
7. The apparatus of claim 1 comprising:
circuit components populated on the first surface including at least one through hole component;
overmolding applied to the first surface wherein the circuit board is substantially planar.
8. The apparatus claim 1 wherein the at least one feature is selected from the group consisting of: pads, heat sinks, and vias.
9. A storage medium having stored thereon instruction data, the instruction data for when executed resulting in the following: receiving a circuit design; laying out the circuit to result in a circuit board such that some components are to be populated on a first surface of the circuit board and another component is to be populated on a second other surface of the circuit board, the first surface for being overmolded; forming conductive features directly on the second surface such that the conductive features physically contacts the second surface; and forming a layer of solder resist directly on the second surface of the circuit board such that the solder resist physically contacts the second surface, the solder resist formed in a fashion resulting in the solder resist remaining approximately coplanar with the conductive features on the second surface.
10. The apparatus of claim 1 , wherein the solder resist is disposed on the second surface without contacting the conductive material.
11. The storage medium of claim 9 , wherein at least one of the conductive features has a top surface and an opposing bottom surface, the top surface of the conductive feature physically contacting the second surface, and
wherein the solder resist has a top surface and an opposing bottom surface, the top surface of the solder resist physically contacting the second surface and the bottom surface of the solder resist being coplanar with the bottom surface of the at least one of the conductive features.