Multi-layer highly reflective ohmic contacts for semiconductor devices
View Patent ↗A high performance, highly reflective ohmic contact, in the visible spectrum (400 nm–750 nm), has the following multi-layer metal profile. A uniform and thin ohmic contact material is deposited and optionally alloyed to the semiconductor surface. A thick reflector layer selected from a group that includes Al, Cu, Au, Rh, Pd, Ag and any multi-layer combinations is deposited over the ohmic contact material.
1. A light-emitting semiconductor device comprising:
a semiconductor structure having at least one p-type and one n-type layer; and
a p contact and an n contact, the p contact electrically connected to the p-type layer, the n contact electrically connected to the n-type layer, wherein at least one of the p and n contacts is a multi-layer contact external to the semiconductor structure, the multi-layer contact comprising:
a metallic reflector layer comprising Ag; and
a continuous uniform conducting sheet adjacent to the semiconductor structure, wherein the continuous uniform conducting sheet comprises Ni and makes ohmic contact to the structure;
wherein the multi-layer contact has a reflectivity greater than 75% for light at an operating wavelength of the light-emitting device and a specific contact resistance less than 10 −2 Ω-cm 2 .
2. A device, as defined in claim 1 , the multi-layer contact further comprising a barrier layer interposing the reflector layer and the continuous uniform conducting sheet.
3. A device, as defined in claim 1 , the reflector layer having a thickness greater than 500 Å.
4. A device, as defined in claim 1 , wherein the continuous uniform conducting sheet has a thickness less than 200 Å.
5. A device, as defined in claim 1 , wherein the continuous uniform conducting sheet is selected from the group that consists of Au/NiO and Ni/Au.
6. A device, as defined in claim 1 , wherein the semiconductor structure includes at least one III-nitride layer.
7. A device, as defined in claim 1 , wherein the continuous uniform conducting sheet absorbs less than 25% of light generated in the semiconductor structure and incident on the continuous uniform conducting sheet.
8. A device, as defined in claim 6 , wherein a voltage required to forward bias the device is less than 3.5 V.
9. A device, as defined in claim 1 , wherein the continuous uniform conducting sheet has thickness less than 100 Å.
10. A light-emitting semiconductor device comprising:
a semiconductor structure having at least one p-type and one n-type layer; and
a p contact and an n contact, the p contact electrically connected to the p-type layer, the n contact electrically connected to the n-type layer, wherein at least one of the p and n contacts is a multi-layer contact external to the semiconductor structure, the multi-layer contact comprising:
a metallic reflector comprising Al; and
a continuous uniform conducting sheet adjacent to the semiconductor structure, wherein the continuous uniform conducting sheet comprises Ni and makes ohmic contact to the structure;
wherein the multi-layer contact has a reflectivity greater than 75% for light at an operating wavelength of the light-emitting device and a specific contact resistance less than 10 −2 Ω-cm 2 .
11. A device, as defined in claim 10 , wherein:
the continuous uniform conducting sheet comprises Au.