Environment exchange control for material on a wafer surface
View Patent ↗Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).
1. A method of providing an environmentally controlled environment during wafer processing comprising:
locating a wafer coated with a layer of unexposed photosensitive material within a post application bake (PAB) module containing a gaseous environment so that the gaseous environment is exposed to the unexposed photosensitive material; and
controlling an exchange of mass between the unexposed photosensitive material and the gaseous environment by measuring at least three independent thermodynamic variables of the gaseous environment and introducing and extracting chemical species in the PAB responsive to the measurements of the thermodynamic variables.
2. The method of claim 1 , further comprising spin casting the unexposed photosensitive material onto the wafer surface.
3. The method of claim 1 , further comprising forming the unexposed photosensitive material on a metal interconnect located on the wafer.
4. The method of claim 1 , wherein controlling the exchange of mass includes controlling a partial pressure of a gaseous species in the gaseous environment.
5. The method of claim 1 , wherein the chemical species includes at least one of helium and argon.
6. The method of claim 1 , wherein the chemical species includes at least one of H 2 O, H 2 , N 2 , and NH 3 .
7. The method of claim 1 , wherein the unexposed photosensitive material is an acetal-based photoresist.