IP Library Granted Patent US 6,939,142
Granted Patent B2
US 6,939,142 · App. 09/739,288 · Granted Sep 6, 2005

Semiconductor device testing contactor having a circuit-side contact piece and test-board-side contact piece

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Quick Facts
Patent No.
US 6,939,142
App. No.
09/739,288
Granted
Sep 6, 2005
Kind
B2
Abstract

A contactor is placed between a semiconductor device and a test board. A contact electrode of the contactor electrically connects the semiconductor device to the test board. The contact electrode is formed of a conductive layer provided on an insulating substrate. The contact electrode includes a first contact piece which contacts a terminal of the semiconductor device, a second contact piece which contacts an electrode of the test board, and a connecting portion which electrically connects the first contact piece and the second contact piece.

Claims (16)

1. A contactor which is placed between a semiconductor device and a test board so as to electrically connect said semiconductor device to said test board, said contactor comprising:

an insulating substrate; and

a plurality of contact electrodes formed by etching a conductive layer plated onto said insulating substrate, each of the contact electrodes comprising a first elongated contact piece which contacts a terminal of said semiconductor device, a second elongated contact piece which contacts an electrode of said test board, and a connecting portion which electrically connects said first contact piece and said second contact piece,

wherein the conductive layer is plated onto the substrate and each contact electrode is formed by etching portions of the conductive layer off of the substrate,

wherein both the first contact piece and the second contact piece are movable contact pieces and are elastically movable by a pressing force applied thereto, and

wherein the first and second contact pieces are aligned through a center of the contact electrode defining a longitudinal direction,

wherein each of said first contact piece and said second contact piece is placed so that the longitudinal direction thereof is on a line extending in a radial direction from a center of said insulating substrate.

2. The contactor as claimed in claim 1 , further comprising an opening in each insulating substrate at a position where said contact electrode is formed, one of said first contact pieces and said second contact piece extending from one surface of said insulating substrate to another surface thereof through said opening.

3. The contactor as claimed in claim 2 , wherein the opening is round or generally round.

4. The contactor as claimed in claim 2 , wherein the connector portion surrounds the opening in the insulating substrate, and wherein the surface and the other surface comprise two parallel faces.

5. The contactor as claimed in claim 4 , wherein the connector portion is generally round.

6. The contactor as claimed in claim 4 , wherein the connector portion is round.

7. The contactor as claimed in claim 1 , wherein said first contact piece and said second contact piece are placed away from each other, and said connecting portion electrically connects said first contact piece and said second contact piece as an interconnection pattern having a predetermined shape.

8. The contactor as claimed in claim 7 , wherein the predetermined shape is generally round.

9. The contactor as claimed in claim 7 , wherein the predetermined shape is round.

10. The contactor as claimed in claim 1 , wherein the insulating substrate comprises two parallel faces; and wherein the conductive layer is formed in contact with one of the two parallel faces.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035507/0612 →
CHANGE OF NAME Recorded Aug 2, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024804/0269 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 5, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021976/0876 →