Electrostatic discharge protection device and method therefor

1. A method for reducing the leakage current through a charge protection device in an integrated circuit, the method comprising:

supplying a bulk region of the charge protection device with a first voltage potential through a first device when the integrated circuit is in operation; and

supplying the bulk region with a second voltage potential through a second device when the integrated circuit experiences an electro-static discharge (ESD) event.

2. method of claim 1 , wherein supplying a bulk region of the charge protection device with a first voltage potential includes reverse body biasing the charge protection device when the integrated circuit is not experiencing an electro-static discharge event.

3. The method of claim 1 , wherein supplying a bulk region of the charge protection device with a first voltage potential further comprises:

applying the first voltage potential to the bulk region of the charge protection device that is higher than the second voltage potential.

4. An apparatus comprising:

an integrated circuit;

a charge protection device coupled to the integrated circuit;

a resistive element to supply a reverse bias to a bulk region of the charge protection device during normal operation of the integrated circuit; and

another device to supply the bulk region with a voltage potential that compensates the reverse bias when the integrated circuit receives an electro-static discharge (ESD) event.

5. The apparatus of claim 4 , wherein the charge protection device comprises a first transistor having a source region and the bulk region, the resistive element being coupled to the bulk region of the transistor.

6. The apparatus of claim 5 , wherein the first transistor comprises a p-channel transistor.

7. The apparatus of claim 4 , wherein the resistive element comprises an n-channel transistor.

8. The apparatus of claim 4 , wherein the integrated circuit comprises a logic transistor having a gate oxide, and the resistive element comprises a transistor having a gate oxide that is thicker than the gate oxide of the logic transistor.

9. The apparatus of claim 5 , wherein the first transistor has a width of at least 500 microns, a channel length of less than about 0.2 microns, and is adapted to conduct at least 1 pulsed amp.

10. An apparatus comprising:

an integrated circuit;

a charge protection device coupled to the integrated circuit, the charge protection device comprising a first transistor and a second transistor, wherein the first transistor and the second transistor are arranged in series;

a buffer having an output coupled to a gate terminal of the first transistor;

a resistive element having a control terminal coupled to the output of the buffer and providing a signal to a gate terminal of the second transistor; and

a voltage divider includes serially connected transistors to supply a voltage potential to an input of the buffer.

11. An apparatus comprising:

a first transistor coupled between a positive power conductor and a ground power conductor to provide charge protection for an integrated circuit;

a resistive element coupled to provide a bulk region of the first transistor with a voltage potential that is greater than a voltage potential supplied on the positive power conductor; and

a second transistor to couple the voltage potential supplied on the positive power conductor to the bulk region of the first transistor when the integrated circuit experiences an electro-static discharge (ESD) event.

12. The apparatus of claim 11 , wherein the resistive element comprises a third transistor.

13. The apparatus of claim 11 , wherein the resistive element comprises a third transistor that has a gate oxide that is thicker than a gate oxide of the first transistor.