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App. No. 09/759,017 · Confirmation No. 1798

CHROMIUM ADHESION LAYER FOR COPPER VIAS IN LOW-K TECHNOLOGY

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2010-03-18 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2001-05-15 DRW Drawings-only black and white line drawings 2 View
2001-01-12 TRNA Transmittal of New Application 2 View
2001-01-12 SPEC Specification 9 View
2001-01-12 CLM Claims 3 View
2001-01-12 ABST Abstract 1 View
2001-01-12 DRW Drawings-only black and white line drawings 2 View
2001-01-12 OATH Oath or Declaration filed 4 View
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Quick Facts
App. No.
09/759,017
Filed
2001-01-11
Granted
2003-04-01
Pub. No.
US20020088117A1
Art Unit
3723
PTA
0 days