Rugged metal electrodes for metal-insulator-metal capacitors
View Patent ↗Thin film metal-insulator-metal capacitors having enhanced surface area are formed by a substituting metal for silicon in a preformed electrode geometry. The resulting metal structures are advantageous for high-density DRAM applications since they have good conductivity, enhanced surface area and are compatible with capacitor dielectric materials having high dielectric constant.
1. A process for fabricating a metal-insulator-metal capacitor on a semiconductor wafer comprising the steps of:
forming a silicon electrode structure on the semiconductor wafer;
making the silicon electrode structure rugged; and
after making the silicon electrode rugged, replacing the silicon in the rugged silicon electrode structure with a metal, thereby forming a rugged metal electrode.
2. The process of claim 1 , further comprising covering the rugged metal electrode with a dielectric layer having a high dielectric constant.
3. The process of claim 2 , further comprising covering the dielectric layer with a metal layer.
4. The process of claim 1 , wherein the step of replacing the silicon in the silicon electrode structure comprises forming a boundary layer on the silicon electrode structure, exposing the silicon electrode structure to a refractory metal-halide complex, and removing the boundary layer.
5. The process of claim 4 , wherein the boundary layer comprises a dielectric and the refractory metal-halide complex comprises WF 6 .
6. The process of claim 2 , wherein the dielectric layer comprises a material selected from the group consisting of Ta 2 O 5 , BaTiO 3 , SrTiO 3 , Ba x Sr 1-x TiO 3 , and PbZr x Ti 1-x O 3 .
7. The process of claim 3 , wherein the metal layer comprises titanium.
8. The process of claim 1 , wherein making the silicon electrode structure rugged comprises seeding and annealing to form a hemispherically grained silicon layer.
9. The process of claim 1 , wherein the rugged silicon electrode structure comprises a hemispherical grain morphology.