Object positioning method for a lithographic projection apparatus
View Patent ↗A method for placement of a object such as a substrate or a mask on a table, said method including: a first placement step in which the object is placed on a first position on the table; a measuring step in which a displacement between the first position of the object and the required position of the object is determined; a removing step in which the object is released and removed from the table; a moving step in which the object and the table are moved relatively to each other by substantially the said displacement, in a direction substantially parallel to the surface of the table; and a second placement step in which the object is placed at the required position on the table.
1. A method of positioning an object at a required position on a first object table in a lithographic projection apparatus, comprising:
placing an object at a first position on the first object table;
measuring a displacement between the first position of the object and a required position of the object on the first object table;
removing the object from the first object table;
translating the removed object, the first object table, or both, relative to each other by substantially the measured displacement, in a direction substantially parallel to the plane of the first object table; and
placing the object at substantially the required position on the first object table,
wherein a first surface of the object contacts the first object table, and wherein the required position corresponds to a position of the object at which a clamping force that clamps the object on the first object table is substantially homogenous on the first surface of the object.
2. A method according to claim 1 , wherein said measuring comprises aligning a first mark on the object to a second mark.
3. A method according to claim 2 , wherein said second mark is located on the one of the first object table and a second object table.
4. A method according to claim 1 , wherein a mask is held by the first object table.
5. A method according to claim 2 , wherein said second mark is located on one of a mask and a substrate.
6. A method according to claim 1 , wherein said measuring is accomplished using imaging means to determine the displacement between the first position of the object and the required position of the object.
7. A method according to claim 1 , wherein said measuring comprises processing information about the first position of the object, together with information regarding the required position of the object to determine said displacement.
8. A method according to claim 1 , wherein said object is held in place using a vacuum generating surface.
9. A method according to claim 1 , wherein the translating includes translating the object, the first object table, or both, relatively to each other in two directions.
10. A method of positioning a substrate at a required position on a substrate table, said method comprising:
placing the substrate at a first position on the substrate table;
measuring a displacement between the first position of the substrate and a required position of the substrate on the substrate table;
removing the substrate from the substrate table;
translating the substrate, the substrate table, or both, relative to each other by substantially the displacement, in a direction substantially parallel to the plane of the substrate table; and
placing the substrate at substantially the required position on the substrate table,
wherein a first surface of the substrate contacts the substrate table, and wherein the required position corresponds to a position of the substrate at which a clamping force that clamps the substrate on the substrate table is substantially homogenous on the first surface of the substrate.
11. A method according to claim 10 , wherein said, measuring comprises aligning a first mark on the substrate to a second mark.
12. A method according to claim 10 , wherein said measuring is accomplished using an imaging device to determine the displacement between the first position of the substrate and the required position of the substrate.
13. A method according to claim 10 , wherein said measuring comprises processing information about the first position of the substrate, together with information regarding the required position of the substrate to determine said displacement.
14. A method according to claim 10 , wherein the translating includes translating the substrate, the substrate table, or both, relatively to each other in two directions.