IP Library Granted Patent US 7,057,656
Granted Patent B2
US 7,057,656 · App. 09/780,682 · Granted Jun 6, 2006

Pixel for CMOS image sensor having a select shape for low pixel crosstalk

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Quick Facts
Patent No.
US 7,057,656
App. No.
09/780,682
Granted
Jun 6, 2006
Kind
B2
Abstract

A novel CMOS image unit pixel layout having a photodiode including an optically optimized square image sensing region. The square image sensing layout provides for reduced electrical and color crosstalk and improved modulation transfer function (MTF) between neighboring pixels of an array of pixels.

Claims (17)

1. An array comprising:

a plurality of CMOS pixels, each CMOS pixel comprising:

a substantially square image sensing region, wherein a distance between the image sensing regions of neighboring pixels is optimized to reduce crosstalk between the neighboring pixels and the distance is at least 3.8 micrometers along a first axis and at least 4 micrometers along a second axis; and

a substantially hemispherical microlens positioned over the image sensing region of each pixel.

2. The array of pixels of claim 1 , wherein the distance is further optimized to improve MTF.

3. The array of claim 1 , wherein the first axis and the second axis are perpendicular.

4. The array of claim 1 , wherein sides of each CMOS pixel are about 8 micrometers.

5. An improved CMOS imaging array having a plurality of pixels for use in a CMOS imaging system, the improvement of each pixel comprising:

a substantially square image sensing region configured to increase the distance between the image sensing regions of neighboring pixels, wherein the distance is at least 3.8 micrometers along a first axis and at least 4 micrometers along a second axis; and

a substantially hemispherical microlens positioned over the image sensing region.

6. The CMOS imaging array of claim 5 , wherein the position of the substantially hemispherical microlens is configured to increase an effective fill factor.

7. The CMOS imaging array of claim 6 , wherein the improvement of each pixel further comprises:

a. a transfer transistor having a drain coupled to the cathode of the photodiode, a gate controlled by a control signal, Tx, and a source coupled to a floating sensing node;

b. a reset transistor having a drain coupled to a reset potential, a gate controlled by a control signal, Rx, and a source coupled to the floating sensing node; and

c. a source follower coupled between the floating sensing node and an output of the unit pixel, the source follower controlled by a select signal.

8. The CMOS imaging array of claim 7 , wherein the transfer transistor, the reset transistor, and the source follower are positioned along at least two sides of the pixel.

9. The CMOS imaging array of claim 7 , wherein the reset transistor is a depletion mode transistor.

Assignments (5)
MERGER Recorded Jul 22, 2011
From: CROSSTEK CAPITAL, LLC
To: INTELLECTUAL VENTURES II LLC
Reel/Frame 026637/0632 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 30, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: CROSSTEK CAPITAL, LLC
Reel/Frame 022764/0270 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2009
From: LEE, DO-YOUNG
To: HYNIX SEMICONDUCTOR, INC.
Reel/Frame 022584/0333 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 23, 2009
From: HYNIX SEMICONDUCTOR INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 022288/0934 →
CHANGE OF NAME Recorded Nov 1, 2004
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015320/0529 →