Patent Assignment
Reel/Frame 022288/0934
Assignment of Assignor's Interest
Recorded: 2009-02-23
Pages: 4
Assignor
HYNIX SEMICONDUCTOR INC.
Executed: 2009-02-19
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
1 HYANGJEONG-DONG, HEUNGDIK-GU, CHEONGJU-SI, CHUNGCHEONGBUK-DO, 361-725, KOREA, REPUBLIC OF
Covered Properties
(12)
Method for Forming Metal Line of Semiconductor Device
Patent:
6,146,999 →
Application:
08/956,387 →
Mask for Recycling and Fabrication Method Thereof
Patent:
6,340,541 →
Application:
09/140,459 →
Solid State Image Sensor and Method for Fabricating the Same
Patent:
6,271,103 →
Application:
09/366,557 →
Method for Manufacturing Semiconductor Device
Patent:
6,180,473 →
Application:
09/468,123 →
Pixel for Cmos Image Sensor Having a Select Shape for Low Pixel Crosstalk
Solid State Image Sensor and Method for Fabricating the Same
Image Sensor and Method for Fabricating the Same
Method for Forming Inductor in Semiconductor Device
Image Sensor with Improved Sensitivity and Method for Driving the Same
Method for Forming Interlayer Insulation Film in Semiconductor Device
Image Sensor and Method for Manufacturing the Same
Method for Manufacturing Cmos Image Sensor Using Spacer Etching Barrier Film
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 25, 2004
From: KIM, YOUNG-JIN
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015523/0388 →
Assignment of Assignor's Interest
Jun 28, 2004
From: KIM, YOUNG KEUN
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015522/0082 →
Assignment of Assignor's Interest
Jun 29, 2004
From: SHIN, KANG SUP; RYU, SANG WOOK
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015525/0772 →
Assignment of Assignor's Interest
Sep 20, 2004
From: RYU, SANG-WOOK
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015817/0854 →
Change of Name
Oct 12, 2004
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015242/0899 →
Change of Name
Nov 1, 2004
From: LG SEMICON CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015320/0542 →
Change of Name
Nov 1, 2004
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015320/0529 →
Security Interest
Mar 25, 2005
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 016470/0530 →
Merger
Apr 16, 2008
From: LG SEMICON CO., LTD.
To: HYUNDAI MICRO ELECTRONICS CO., LTD.
Reel/Frame 020808/0383 →
Merger
Apr 16, 2008
From: HYUNDAI MICRO ELECTRONICS CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 020808/0368 →
Assignment of Assignor's Interest
Apr 23, 2009
From: LEE, DO-YOUNG
To: HYNIX SEMICONDUCTOR, INC.
Reel/Frame 022584/0333 →
Corrective Assignment to Correct the Receiving Party and Execution Date Previously Recorded on Reel 011033 Frame 0103. Assignor(S) Hereby Confirms the Receiving Party Should Be Hyundai Microelectronics and Execution Date Should Be 07/26/1999.
May 19, 2009
From: LG SEMICON CO., LTD.
To: HYUNDAI MICROELECTRONICS CO., LTD.
Reel/Frame 022708/0040 →
Corrective Assignment to Correct the Conveyance Type, Receiving Party and Execution Date Previously Recorded on Reel 011079 Frame 0719. Assignor(S) Hereby Confirms the Conveyance Type Is Name Change, Receiving Party Is Hyundai Microelectronics Co., Ltd and Date Is 07/26/1999.
May 22, 2009
From: LG SEMICON CO. LTD.
To: HYUNDAI MICROELECTRONICS CO., LTD
Reel/Frame 022727/0102 →
Corrective Assignment to Correct the Conveyance Type and Conveying Party Previously Recorded on Reel 020808 Frame 0368. Assignor(S) Hereby Confirms the Conveyance Type Is Name Change and Conveying Party Is Hyundai Electronics Industries Co., Ltd..
May 22, 2009
From: HYUNDAI ELECTRONICS IND. CO., LTD. (BRANCH OFFICE)
To: HYNIX SEMICONDUCTOR INC. (BRANCH OFFICE)
Reel/Frame 022722/0666 →
Corrective Assignment to Correct the Conveyance to Name Change Previously Recorded on Reel 020808 Frame 0383. Assignor(S) Hereby Confirms the Conveyance Should Be Name Change.
May 22, 2009
From: LG SEMICON CO., LTD.
To: HYUNDAI MICRO ELECTRONICS CO., LTD. (BRANCH OFFICE)
Reel/Frame 022722/0889 →
Corrective Assignment to Correct the Conveyance Type, Conveying Party, Receiving Party and Execution Date Previously Recorded on Reel 015320 Frame 0542. Assignor(S) Hereby Confirms the Merger from Hyundai Micro Electronics Co., Ltd., to Hyundai Electronics Industries Co., Ltd. on 10/14/1999.
May 22, 2009
From: HYUNDAI MICRO ELECTRONICS CO., LTD.
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.,
Reel/Frame 022727/0119 →
Merger
May 27, 2009
From: HYUNDAI MICRO ELECTRONICS CO., LTD.
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 022742/0478 →
Change of Name
May 27, 2009
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 022742/0555 →
Corrective Assignment to Correct the Country in the Address of the Receiving Party Previously Recorded on Reel 022742 Frame 0478. Assignor(S) Hereby Confirms the Country Should Be Republic of Korea.
May 28, 2009
From: HYUNDAI MICRO ELECTRONICS CO., LTD.
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 022746/0279 →
Assignment of Assignor's Interest
May 30, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: CROSSTEK CAPITAL, LLC
Reel/Frame 022764/0270 →
Assignment of Assignor's Interest
Aug 12, 2009
From: CROSSTEK CAPITAL, LLC
To: CHUNG CHENG HOLDINGS, LLC
Reel/Frame 023085/0877 →
Assignment of Assignor's Interest
Oct 21, 2009
From: LEE, CHUN TAK
To: LG SEMICON CO., LTD.
Reel/Frame 023401/0645 →
Release of Security Interest
Jun 22, 2010
From: U.S. BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 024563/0807 →
Merger
Jul 22, 2011
From: CROSSTEK CAPITAL, LLC
To: INTELLECTUAL VENTURES II LLC
Reel/Frame 026637/0632 →
Assignment of Assignor's Interest
Apr 16, 2014
From: LEE, JU-IL
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 032683/0602 →