IP Library › Assignment 015525/0772
Patent Assignment
Reel/Frame 015525/0772

Assignment of Assignor's Interest

Recorded: 2004-06-29 Pages: 2
Assignors
SHIN, KANG SUP
Executed: 2004-06-10
RYU, SANG WOOK
Executed: 2004-06-10
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUP, ICHON-SHI, KYUNGKI-DO, 467-860, KOREA, REPUBLIC OF
Covered Property (1)
Method for Forming Interlayer Insulation Film in Semiconductor Device
Patent: 7,160,810 →
Application: 10/878,317 →
Publication: US 2005/0142848
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 23, 2009
From: HYNIX SEMICONDUCTOR INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 022288/0934 →
Assignment of Assignor's Interest Sep 3, 2020
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: KEY FOUNDRY CO., LTD.
Reel/Frame 053703/0227 →
Change of Name Mar 12, 2024
From: KEY FOUNDRY CO., LTD.
To: SK KEYFOUNDRY INC.
Reel/Frame 066794/0290 →