Patent Assignment
Reel/Frame 015320/0542
Change of Name
Recorded: 2004-11-01
Pages: 46
Assignor
LG SEMICON CO., LTD.
Executed: 1999-07-26
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Properties
(7)
Chip Carrier with Embedded Leads and Chip Package Using Same
Patent:
6,002,170 →
Application:
08/687,929 →
Plate and Column Type Semiconductor Package Having Heat Sink
Patent:
5,877,561 →
Application:
08/749,963 →
Lead Frame Having Supporters and Semiconductor Package Using Same
Patent:
6,093,959 →
Application:
08/785,019 →
Lead Frame and Semiconductor Package
Patent:
5,898,212 →
Application:
08/785,592 →
Method for Forming Metal Line of Semiconductor Device
Patent:
6,146,999 →
Application:
08/956,387 →
Fabrication Method for Semiconductor Package Substrate and Semiconductor Package
Patent:
5,963,796 →
Application:
09/027,185 →
Device Isolation Structure and Device Isolation Method for a Semiconductor Power Integrated Circuit
Patent:
6,171,930 →
Application:
09/233,463 →
Related Assignments
(13)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Mar 25, 2005
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 016470/0530 →
Assignment of Assignor's Interest
Feb 23, 2009
From: HYNIX SEMICONDUCTOR INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 022288/0934 →
Corrective Assignment to Correct the Conveyance Type, Receiving Party and Execution Date Previously Recorded on Reel 011079 Frame 0719. Assignor(S) Hereby Confirms the Conveyance Type Is Name Change, Receiving Party Is Hyundai Microelectronics Co., Ltd and Date Is 07/26/1999.
May 22, 2009
From: LG SEMICON CO. LTD.
To: HYUNDAI MICROELECTRONICS CO., LTD
Reel/Frame 022727/0102 →
Corrective Assignment to Correct the Conveyance Type, Conveying Party, Receiving Party and Execution Date Previously Recorded on Reel 015320 Frame 0542. Assignor(S) Hereby Confirms the Merger from Hyundai Micro Electronics Co., Ltd., to Hyundai Electronics Industries Co., Ltd. on 10/14/1999.
May 22, 2009
From: HYUNDAI MICRO ELECTRONICS CO., LTD.
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.,
Reel/Frame 022727/0119 →
Change of Name
May 27, 2009
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 022742/0555 →
Assignment of Assignor's Interest
May 30, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: CROSSTEK CAPITAL, LLC
Reel/Frame 022764/0270 →
Nunc Pro Tunc Assignment
Aug 5, 2009
From: HYNIX SEMICONDUCTOR INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 023056/0273 →
Assignment of Assignor's Interest
Aug 12, 2009
From: CROSSTEK CAPITAL, LLC
To: CHUNG CHENG HOLDINGS, LLC
Reel/Frame 023085/0877 →
Release of Security Interest
Jun 22, 2010
From: U.S. BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 024563/0807 →
Corrective Assignment to Correct the Receiving Party Address Previously Recorded at Reel: 024563 Frame: 0807. Assignor(S) Hereby Confirms the Release by Secured Party.
Nov 25, 2014
From: US BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 034469/0001 →
Assignment of Assignor's Interest
Jan 18, 2019
From: MAGNACHIP SEMICONDUCTOR, LTD
To: ATRIA TECHNOLOGIES INC.
Reel/Frame 048058/0864 →
Assignment of Assignor's Interest
Jan 4, 2020
From: INTELLECTUAL VENTURES ASSETS 158 LLC
To: HANGER SOLUTIONS, LLC
Reel/Frame 051486/0425 →
Assignment of Assignor's Interest
Feb 1, 2020
From: CHUNG CHENG HOLDINGS, LLC
To: INTELLECTUAL VENTURES ASSETS 158 LLC
Reel/Frame 051777/0063 →