Patent Assignment
Reel/Frame 051777/0063
Assignment of Assignor's Interest
Recorded: 2020-02-01
Pages: 12
Assignor
CHUNG CHENG HOLDINGS, LLC
Executed: 2019-11-26
Assignee
INTELLECTUAL VENTURES ASSETS 158 LLC
251 LITTLE FALLS DRIVE, WILMINGTON, DELAWARE, 19808
Covered Properties
(15)
Method of Fabricating Laser Diode
Patent:
5,770,474 →
Application:
08/882,179 →
Method for Forming Metal Line of Semiconductor Device
Patent:
6,146,999 →
Application:
08/956,387 →
Method of Forming Contact Plugs in Semiconductor Device Having Different Sized Contact Holes
Patent:
6,028,000 →
Application:
08/960,899 →
Method of Manufacturing a Semiconductor Device Including Implanting Threshold Voltage Adjustment Ions
Patent:
6,090,652 →
Application:
08/996,011 →
Mask Set for Measuring an Overlapping Error and Method of Measuring an Overlapping Error Using the Same
Patent:
6,730,528 →
Application:
08/999,401 →
Method for Fabricating Ic for Use in Communication
Patent:
6,080,615 →
Application:
09/002,679 →
A Repairable Multichip Module
Patent:
6,020,597 →
Application:
09/034,699 →
Method for Fabricating Inductor of Semiconductor Device
Patent:
6,015,742 →
Application:
09/053,500 →
Method for Forming Conductive Film for Semiconductor Device
Patent:
6,083,833 →
Application:
09/097,680 →
Method for Measuring Width of Wire in Semiconductor Device Using Measuring-Pattern
Patent:
6,127,197 →
Application:
09/104,716 →
Mask for Recycling and Fabrication Method Thereof
Patent:
6,340,541 →
Application:
09/140,459 →
Cmos Device and Method for Fabricated the Same
Patent:
6,204,100 →
Application:
09/249,314 →
Measuring-Pattern for Measuring Width of Wire in Semiconductor Device
Patent:
6,462,565 →
Application:
09/644,992 →
The Method of Forming Cmos Device
Mask set for measuring an overlapping error and method of measuring an overlapping error using the same
Application:
10/793,743 →
Publication:
US 2005/0172256
Related Assignments
(24)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Apr 9, 2002
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 012795/0502 →
Change of Name
Oct 12, 2004
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015242/0899 →
Change of Name
Oct 12, 2004
From: LG SEMICON CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015246/0634 →
Change of Name
Nov 1, 2004
From: LG SEMICON CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015320/0542 →
Assignment of Assignor's Interest
Jan 10, 2005
From: HYNIX SEMICONDUCTOR, INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 016216/0649 →
Security Interest
Mar 25, 2005
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 016470/0530 →
Confirmation of Assignment
Dec 19, 2007
From: HYNIX SEMICONDUCTOR, INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 020261/0756 →
After-Acquired Intellectual Property Kun-Pledge Agreement
Feb 18, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 022277/0133 →
Assignment of Assignor's Interest
Feb 23, 2009
From: HYNIX SEMICONDUCTOR INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 022288/0934 →
Corrective Assignment to Correct the Receiving Party and Execution Date Previously Recorded on Reel 011033 Frame 0103. Assignor(S) Hereby Confirms the Receiving Party Should Be Hyundai Microelectronics and Execution Date Should Be 07/26/1999.
May 19, 2009
From: LG SEMICON CO., LTD.
To: HYUNDAI MICROELECTRONICS CO., LTD.
Reel/Frame 022708/0040 →
Corrective Assignment to Correct the Receiving Party Data Previously Recorded on Reel 015246 Frame 0634. Assignor(S) Hereby Confirms the Assignee Should Be Hyundai Micro Electronics Co., Ltd (Branch Office).
May 19, 2009
From: LG SEMICON CO., LTD.
To: HYUNDAI MICRO ELECTRONICS CO., LTD. (BRANCH OFFICE)
Reel/Frame 022703/0582 →
Corrective Assignment to Correct the Conveying Party, Receiving Party and Execution Date Previously Recorded on Reel 011301 Frame 0641. Assignor(S) Hereby Confirms the Conveying Party Is Lg Semicon Co., Ltd., Receiving Party Is Hyundai Microelectronics Co., Ltd., and Date Is 7/26/1999.
May 21, 2009
From: LG SEMICON CO., LTD.
To: HYUNDAI MICROELECTRONICS CO., LTD.
Reel/Frame 022719/0638 →
Corrective Assignment to Correct the Conveyance Type, Receiving Party and Execution Date Previously Recorded on Reel 011079 Frame 0719. Assignor(S) Hereby Confirms the Conveyance Type Is Name Change, Receiving Party Is Hyundai Microelectronics Co., Ltd and Date Is 07/26/1999.
May 22, 2009
From: LG SEMICON CO. LTD.
To: HYUNDAI MICROELECTRONICS CO., LTD
Reel/Frame 022727/0102 →
Corrective Assignment to Correct the Conveyance Type, Conveying Party, Receiving Party and Execution Date Previously Recorded on Reel 015320 Frame 0542. Assignor(S) Hereby Confirms the Merger from Hyundai Micro Electronics Co., Ltd., to Hyundai Electronics Industries Co., Ltd. on 10/14/1999.
May 22, 2009
From: HYUNDAI MICRO ELECTRONICS CO., LTD.
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.,
Reel/Frame 022727/0119 →
Change of Name
May 27, 2009
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 022742/0555 →
Merger
May 27, 2009
From: HYUNDAI MICRO ELECTRONICS CO., LTD.
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 022742/0478 →
Corrective Assignment to Correct the Country in the Address of the Receiving Party Previously Recorded on Reel 022742 Frame 0478. Assignor(S) Hereby Confirms the Country Should Be Republic of Korea.
May 28, 2009
From: HYUNDAI MICRO ELECTRONICS CO., LTD.
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 022746/0279 →
Partial Release of Security Interest
May 30, 2009
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 022746/0870 →
Assignment of Assignor's Interest
May 30, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: CROSSTEK CAPITAL, LLC
Reel/Frame 022764/0270 →
Assignment of Assignor's Interest
Jul 7, 2009
From: CHO, GYUNG-SU
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 022917/0211 →
Partial Release of Security Interest
Aug 10, 2009
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 023075/0054 →
Assignment of Assignor's Interest
Aug 12, 2009
From: CROSSTEK CAPITAL, LLC
To: CHUNG CHENG HOLDINGS, LLC
Reel/Frame 023085/0877 →
Assignment of Assignor's Interest
Jan 4, 2020
From: INTELLECTUAL VENTURES ASSETS 158 LLC
To: HANGER SOLUTIONS, LLC
Reel/Frame 051486/0425 →
Assignment of Assignor's Interest
Apr 6, 2022
From: HANGER SOLUTIONS, LLC
To: TUMBLEWEED HOLDINGS LLC
Reel/Frame 059620/0066 →