Patent Assignment
Reel/Frame 022917/0211
Assignment of Assignor's Interest
Recorded: 2009-07-07
Pages: 6
Assignor
CHO, GYUNG-SU
Executed: 2009-07-02
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
1, HYANGJEONG-DONG, HUNGDUK-GU, CHEONGJU-SI, CHUNGBUK, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming Contact Plugs in Semiconductor Device Having Different Sized Contact Holes
Patent:
6,028,000 →
Application:
08/960,899 →
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Oct 12, 2004
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015242/0899 →
Assignment of Assignor's Interest
Jan 10, 2005
From: HYNIX SEMICONDUCTOR, INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 016216/0649 →
Security Interest
Mar 25, 2005
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 016470/0530 →
Partial Release of Security Interest
May 30, 2009
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 022746/0870 →
Assignment of Assignor's Interest
May 30, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: CROSSTEK CAPITAL, LLC
Reel/Frame 022764/0270 →
Assignment of Assignor's Interest
Aug 12, 2009
From: CROSSTEK CAPITAL, LLC
To: CHUNG CHENG HOLDINGS, LLC
Reel/Frame 023085/0877 →
Assignment of Assignor's Interest
Jan 4, 2020
From: INTELLECTUAL VENTURES ASSETS 158 LLC
To: HANGER SOLUTIONS, LLC
Reel/Frame 051486/0425 →
Assignment of Assignor's Interest
Feb 1, 2020
From: CHUNG CHENG HOLDINGS, LLC
To: INTELLECTUAL VENTURES ASSETS 158 LLC
Reel/Frame 051777/0063 →