IP Library › Assignment 023056/0273
Patent Assignment
Reel/Frame 023056/0273

Nunc Pro Tunc Assignment

Recorded: 2009-08-05 Pages: 4
Assignor
HYNIX SEMICONDUCTOR INC.
Executed: 2009-07-30
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
1 HYANGJEONG-DONG, HEUNGDUK-GU, CHEONGJU-SI, CHUNGCHEONGBUK-DO, 361-725, KOREA, REPUBLIC OF
Covered Properties (8)
Chip Carrier with Embedded Leads and Chip Package Using Same
Patent: 6,002,170 →
Application: 08/687,929 →
Plate and Column Type Semiconductor Package Having Heat Sink
Patent: 5,877,561 →
Application: 08/749,963 →
Lead Frame Having Supporters and Semiconductor Package Using Same
Patent: 6,093,959 →
Application: 08/785,019 →
Lead Frame and Semiconductor Package
Patent: 5,898,212 →
Application: 08/785,592 →
Device Isolation Structure and Device Isolation Method for a Semiconductor Power Integrated Circuit
Patent: 6,171,930 →
Application: 09/233,463 →
Semiconductor Package Substrate and Semiconductor Package
Patent: 6,181,560 →
Application: 09/412,646 →
Lead Frame and Bottom Lead Semiconductor Package Using the Lead Frame
Patent: 6,664,614 →
Application: 09/415,268 →
Publication: US 2002/0167074
Method for Fabricating Capacitor of Semiconductor Device
Patent: 6,465,301 →
Application: 09/996,615 →
Publication: US 2002/0160569
Related Assignments (8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 30, 2001
From: CHEONG, YEON WOO
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 012340/0880 →
Change of Name Nov 1, 2004
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015320/0529 →
Change of Name Nov 1, 2004
From: LG SEMICON CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015320/0542 →
Security Interest Mar 25, 2005
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 016470/0530 →
Release of Security Interest Jun 22, 2010
From: U.S. BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 024563/0807 →
Corrective Assignment to Correct the Receiving Party Address Previously Recorded at Reel: 024563 Frame: 0807. Assignor(S) Hereby Confirms the Release by Secured Party. Nov 25, 2014
From: US BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 034469/0001 →
Assignment of Assignor's Interest Jan 18, 2019
From: MAGNACHIP SEMICONDUCTOR, LTD
To: ATRIA TECHNOLOGIES INC.
Reel/Frame 048058/0864 →
Assignment of Assignor's Interest Sep 3, 2020
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: KEY FOUNDRY CO., LTD.
Reel/Frame 053703/0227 →