IP Library › Granted Patent US 6,432,750
Granted Patent Utility
US 6,432,750 · Confirmation No. 6994

POWER MODULE PACKAGE HAVING INSULATOR TYPE HEAT SINK ATTACHED TO REAR SURFACE OF LEAD FRAME AND MANUFACTURING METHOD THEREOF

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 Code Description Pages PDF
2001-02-22 TRNA Transmittal of New Application 2 View
2001-02-22 ADS Application Data Sheet 2 View
2001-02-22 SPEC Specification 9 View
2001-02-22 CLM Claims 3 View
2001-02-22 ABST Abstract 1 View
2001-02-22 DRW Drawings-only black and white line drawings 5 View
2001-02-22 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,432,750
App. No.
09/789,557
Filed
2001-02-22
Granted
2002-08-13
Pub. No.
US20010052639A1
Art Unit
2822
PTA
0 days