Patent Assignment
Reel/Frame 011561/0725
Assignment of Assignor's Interest
Recorded: 2001-02-22
Pages: 5
Assignors
JEON, GI-YOUNG
Executed: 2001-02-12
IM, EUL-BIN
Executed: 2001-02-12
KIM, BYEONG GON
Executed: 2001-02-12
LEE, EUN-HO
Executed: 2001-02-12
Assignee
FAIRCHILD KOREA SEMICONDUCTOR LTD.
82-3, DODAN-DONG, WONMI-KU, PUCHON, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Power Module Package Having Insulator Type Heat Sink Attached to Rear Surface of Lead Frame and Manufacturing Method Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 2, 2017
From: FAIRCHILD KOREA SEMICONDUCTOR, LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044361/0205 →
Patent Security Agreement
Jul 11, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046530/0460 →
Release of Security Interest in Patents Recorded at Reel 046530, Frame 0460
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064075/0001 →