IP Library › Granted Patent US 6,613,675
Granted Patent Utility
US 6,613,675 · Confirmation No. 1676

METHODS, APPARATUSES, AND SUBSTRATE ASSEMBLY STRUCTURES FOR FABRICATING MICROELECTRONIC COMPONENTS USING MECHANICAL AND CHEMICAL-MECHANICAL PLANARIZATION PROCESSES

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 Code Description Pages PDF
2005-07-26 COCOUT Certificate of Correction - Post Issue Communication 2 View
2005-02-04 COCOUT Certificate of Correction - Post Issue Communication 2 View
2001-02-20 TRNA Transmittal of New Application 4 View
2001-02-20 ADS Application Data Sheet 2 View
2001-02-20 A.PE Preliminary Amendment 2 View
2001-02-20 SPEC Specification 16 View
2001-02-20 CLM Claims 17 View
2001-02-20 ABST Abstract 1 View
2001-02-20 DRW Drawings-only black and white line drawings 7 View
2001-02-20 OATH Oath or Declaration filed 10 View
2001-02-20 TRNA Transmittal of New Application 4 View
2001-02-20 ADS Application Data Sheet 2 View
2001-02-20 A.PE Preliminary Amendment 2 View
2001-02-20 SPEC Specification 16 View
2001-02-20 CLM Claims 17 View
2001-02-20 ABST Abstract 1 View
2001-02-20 DRW Drawings-only black and white line drawings 7 View
2001-02-20 OATH Oath or Declaration filed 10 View
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Quick Facts
Patent No.
US 6,613,675
App. No.
09/790,191
Filed
2001-02-20
Granted
2003-09-02
Pub. No.
US20010019895A1
Examiner
TRAN, BINH X
Art Unit
1765
PTA
-148 days