IP Library Granted Patent US 7,018,947
Granted Patent B2
US 7,018,947 · App. 09/790,442 · Granted Mar 28, 2006

Low resistivity silicon carbide

Assignee: Shipley Company, L.L.C.
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Quick Facts
Patent No.
US 7,018,947
App. No.
09/790,442
Granted
Mar 28, 2006
Kind
B2
Abstract

Free standing articles of chemical vapor deposited silicon carbide with electrical resistivities of less than 0.9 ohm-cm are provided without substantially degrading its thermal conductivity or other properties.

Claims (18)

1. A free standing article comprising chemical vapor deposited, low-resistivity silicon carbide having a nitrogen concentration of at least 6.3×10 18 atoms N per cubic centimeter and an electrical resistivity of less than 0.9 ohm-cm.

2. The free standing article of claim 1 further characterized by having a thermal conductivity of at least 195 W/mK.

3. The free standing article of claim 1 further characterized by having a thermal conductivity of at least 195 W/mK.

4. The free standing article of claim 1 further characterized by containing less than 10 ppmw of trace elements.

5. The free standing article of claim 4 further characterized by containing less than 5 ppmw of trace elements.

6. The free standing article of claim 1 further characterized by a density of at least 3.0 g/cc.

7. The free standing article of claim 1 further characterized by a flexural strength of at least 390 MPa.

8. The free standing article of claim 1 further characterized by having a thermal conductivity of at least 250 W/mK.

9. The free standing article of claim 1 further characterized by containing less than 10 ppmw of trace elements.

10. The free standing article of claim 9 further characterized by containing less than 5 ppmw of trace elements.

11. Tho free standing article of claim 1 farther characterized by a density of at least 3.0 g/cc.

12. The free standing article of claim 1 having a nitrogen concentration of at least 1.0×10 19 atoms N per cubic centimeter.

13. The free standing article of claim 1 having an electrical resistivity of no more than 0.5 ohm-cm.

14. The free standing article of claim 1 further characterized by a flexural strength of at least 390 MPa.

15. The free standing article of claim 1 further characterized by having a thermal conductivity of at least 250 W/mK.

16. A free standing article comprising chemical vapor deposited, low-resistivity silicon carbide having a nitrogen concentration of at least 6.3×10 18 atoms N per cubic centimeter and an electrical resistivity of less than 0.9 ohm-cm and a flexural strength of at least 390 MPa.

17. A free standing article comprising chemical vapor deposited, low-resistivity silicon carbide having a nitrogen concentration of at least 6.3×10 18 atoms N per cubic centimeter and an electrical resistivity of less than 0.9 ohm-cm and a thermal conductivity of between 260 W/mK and 329 W/mK.

18. A free standing article of claim 17 wherein the average thermal conductivity is 282 W/mK.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 7, 2016
From: ROHM AND HAAS ELECTRONIC MATERIALS LLC
To: TOKAI CARBON CO., LTD.
Reel/Frame 039939/0740 →
CHANGE OF NAME Recorded Sep 2, 2016
From: SHIPLEY COMPANY, L.L.C.
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 039910/0517 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2001
From: GOELA, JITENDRA S.; PICKERING, MICHAEL A.
To: SHIPLEY COMPANY, L.L.C.
Reel/Frame 011985/0456 →
Continuity (2)
Provisional Application 6018476600 · Feb 24, 2000
Related Publication 20020004444A1 · Jan 10, 2002