Solid state imaging apparatus
View Patent ↗A solid state imaging apparatus includes a solid state imaging element, an optical lens held by a frame, and a flexible printed circuit board having first and second surfaces. The solid state imaging element is mounted on the first surface of the flexible printed circuit board and the frame is mounted on the surface.
1. A solid state imaging apparatus comprising:
a solid state imaging element having first and second surfaces, an imaging area on the first surface, and flip-chip joining portions on the first surface;
an image signal processing chip having first and second surfaces and flip-chip joining portions on the first surface of the image signal processing chip;
an optical lens held by a frame; and
a flexible circuit board having first and second surfaces and wiring on the first surface of the flexible circuit board, wherein
the solid state imaging element and the image signal processing chip are flip-chip mounted on the first surface of the flexible circuit board,
the frame is mounted on the second surface of the flexible circuit board, and
the flexible circuit board is bent so that the second surface of the image signal processing chip faces the second surface of the solid state imaging element.
2. The solid state imaging apparatus according to claim 1 , including a chip component mounted on the flexible circuit board.
3. The solid state imaging apparatus according to claim 1 , including an optical filter held in the frame.
4. The solid state imaging apparatus according to claim 1 , wherein the frame comprises a fixing pedestal on the second surface of the flexible circuit board and a fixing cap.
5. The solid state imaging apparatus according to claim 4 wherein location of the fixing cap with respect to the fixing pedestal is changed to effect focus adjustment.
6. The solid state imaging apparatus according to claim 1 , wherein the flexible circuit board includes a lead wire portion having an external connection terminal.
7. The solid state imaging apparatus according to claim 6 , wherein the external connection terminal is located on the first surface of the flexible circuit board.
8. The solid state imaging apparatus according to claim 1 , wherein the image signal processing chip is adhered to the solid state imaging element.
9. The solid state imaging apparatus according to claim 1 , wherein the flip-chip joining portions of the solid state imaging element are electrically connected to the flip-chip joining portions of the image signal processing chip via the wiring of the flexible circuit board.