Granted Patent
Utility
US 6,361,417
· Confirmation No. 4856
Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-02-27 | TRNA |
Transmittal of New Application | 4 | View | |
| 2001-02-27 | ADS |
Application Data Sheet | 2 | View | |
| 2001-02-27 | A.PE |
Preliminary Amendment | 2 | View | |
| 2001-02-27 | SPEC |
Specification | 17 | View | |
| 2001-02-27 | CLM |
Claims | 18 | View | |
| 2001-02-27 | ABST |
Abstract | 1 | View | |
| 2001-02-27 | DRW |
Drawings-only black and white line drawings | 8 | View | |
| 2001-02-27 | OATH |
Oath or Declaration filed | 7 | View |
Inventors
Michael A. Walker
Kuna, ID
Karl M. Robinson
Boise, ID
Attorneys & Agents of Record
Classification
USPC
451/168
Prosecution
- Examiner
- MCDONALD, SHANTESE L
- Art Unit
- 3723
- Customer No.
- 27076
- Docket No.
- 500030.04
- Confirmation No.
- 4856
Publication
- Pub. No.
- US20010006877A1
- Pub. Date
- 2001-07-05
Patent Term Adjustment
-67days
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2010-01-04
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Quick Facts
- Patent No.
- US 6,361,417
- App. No.
- 09/795,248
- Filed
- 2001-02-27
- Granted
- 2002-03-26
- Pub. No.
- US20010006877A1
- Examiner
- MCDONALD, SHANTESE L
- Art Unit
- 3723
- PTA
- -67 days
External Links