Granted Patent
Utility
US 6,331,139
· Confirmation No. 6562
Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-02-27 | TRNA |
Transmittal of New Application | 3 | View | |
| 2001-02-27 | ADS |
Application Data Sheet | 2 | View | |
| 2001-02-27 | A.PE |
Preliminary Amendment | 2 | View | |
| 2001-02-27 | SPEC |
Specification | 17 | View | |
| 2001-02-27 | CLM |
Claims | 18 | View | |
| 2001-02-27 | ABST |
Abstract | 1 | View | |
| 2001-02-27 | DRW |
Drawings-only black and white line drawings | 8 | View | |
| 2001-02-27 | OATH |
Oath or Declaration filed | 7 | View |
Inventors
Michael A. Walker
Kuna, ID
Karl M. Robinson
Boise, ID
Attorneys & Agents of Record
Classification
USPC
451/490
Prosecution
- Examiner
- MCDONALD, SHANTESE L
- Art Unit
- 3723
- Customer No.
- 27076
- Docket No.
- 500030.02
- Confirmation No.
- 6562
Publication
- Pub. No.
- US20010006879A1
- Pub. Date
- 2001-07-05
Patent Term Adjustment
0days
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2010-01-04
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Quick Facts
- Patent No.
- US 6,331,139
- App. No.
- 09/795,283
- Filed
- 2001-02-27
- Granted
- 2001-12-18
- Pub. No.
- US20010006879A1
- Examiner
- MCDONALD, SHANTESE L
- Art Unit
- 3723
- PTA
- 0 days
External Links