Granted Patent
Utility
US 6,503,433
· Confirmation No. 7912
LIQUID TRANSFER MOLDING SYSTEM FOR ENCAPSULATING SEMICONDUCTOR INTEGRATED CIRCUITS
Inventor:
Haryanto Chandra
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-04-06 | TRNA |
Transmittal of New Application | 2 | View | |
| 2001-04-06 | SPEC |
Specification | 10 | View | |
| 2001-04-06 | CLM |
Claims | 4 | View | |
| 2001-04-06 | ABST |
Abstract | 1 | View | |
| 2001-04-06 | OATH |
Oath or Declaration filed | 3 | View | |
| 2001-04-06 | DRW |
Drawings-only black and white line drawings | 5 | View |
Inventors
Haryanto Chandra
Sunnyvale, CA
Attorneys & Agents of Record
Classification
USPC
264/272.14
B29C70/70
H10W74/016
B29C45/02
B29C45/18
Prosecution
- Examiner
- ORTIZ, ANGELA Y
- Art Unit
- 1732
- Customer No.
- 26161
- Docket No.
- 99P7707US01
- Confirmation No.
- 7912
Publication
- Pub. No.
- US20020153637A1
- Pub. Date
- 2002-10-24
Patent Term Adjustment
-32days
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2012-09-27
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Quick Facts
- Patent No.
- US 6,503,433
- App. No.
- 09/827,607
- Filed
- 2001-04-06
- Granted
- 2003-01-07
- Pub. No.
- US20020153637A1
- Examiner
- ORTIZ, ANGELA Y
- Art Unit
- 1732
- PTA
- -32 days
External Links