IP Library Granted Patent US 6,489,676
Granted Patent Utility
US 6,489,676 · Confirmation No. 9831

SEMICONDUCTOR DEVICE HAVING AN INTERCONNECTING POST FORMED ON AN INTERPOSER WITHIN A SEALING RESIN

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Code Description Pages PDF
2001-04-30 TRNA Transmittal of New Application 3 View
2001-04-30 SPEC Specification 19 View
2001-04-30 CLM Claims 5 View
2001-04-30 ABST Abstract 1 View
2001-04-30 DRW Drawings-only black and white line drawings 10 View
2001-04-30 OATH Oath or Declaration filed 5 View
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Quick Facts
Patent No.
US 6,489,676
App. No.
09/843,912
Filed
2001-04-30
Granted
2002-12-03
Pub. No.
US20020066952A1
Art Unit
2815
PTA
0 days