IP Library › Granted Patent US 6,645,643
Granted Patent Utility
US 6,645,643 · Confirmation No. 9051

POLYMERIC COMPOSITION FOR PACKAGING A SEMICONDUCTOR ELECTRONIC DEVICE AND PACKAGING OBTAINED THEREFROM

Patented Case View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2014-03-06 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2003-09-02 A.NA Amendment after Notice of Allowance (Rule 312) 2 View
2003-09-02 REM Applicant Arguments/Remarks Made in an Amendment 2 View
2003-09-02 DRW Drawings-only black and white line drawings 2 View
2003-06-30 IFEE Issue Fee Payment (PTO-85B) 1 View
2001-04-27 TRNA Transmittal of New Application 1 View
2001-04-27 A.PE Preliminary Amendment 11 View
2001-04-27 SPEC Specification 15 View
2001-04-27 CLM Claims 4 View
2001-04-27 ABST Abstract 1 View
2001-04-27 DRW Drawings-only black and white line drawings 10 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
Patent No.
US 6,645,643
App. No.
09/844,505
Filed
2001-04-27
Granted
2003-11-11
Pub. No.
US20020022679A1
Art Unit
1712
PTA
-74 days