IP Library Patent Application 09849391
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App. No. 09/849,391 · Confirmation No. 9489

Dual damascene structure for the wiring-line structures of multi-level interconnects in integrated circuit

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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Code Description Pages PDF
2001-05-04 TRNA Transmittal of New Application 3 View
2001-05-04 A.PE Preliminary Amendment 5 View
2001-05-04 SPEC Specification 10 View
2001-05-04 CLM Claims 4 View
2001-05-04 ABST Abstract 1 View
2001-05-04 DRW Drawings-only black and white line drawings 5 View
2001-05-04 OATH Oath or Declaration filed 3 View
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Quick Facts
App. No.
09/849,391
Filed
2001-05-04
Pub. No.
US20030189254A1
Examiner
VU, HUNG K
Art Unit
2811