IP Library Granted Patent US 6,561,878
Granted Patent Utility
US 6,561,878 · Confirmation No. 8449

METHODS AND APPARATUSES FOR MECHANICAL AND CHEMICAL-MECHANICAL PLANARIZATION OF MICROELECTRONIC-DEVICE SUBSTRATE ASSEMBLIES ON PLANARIZING PADS

⬇ PDF
Code Description Pages PDF
2001-05-11 TRNA Transmittal of New Application 3 View
2001-05-11 ADS Application Data Sheet 2 View
2001-05-11 A.PE Preliminary Amendment 3 View
2001-05-11 SPEC Specification 17 View
2001-05-11 CLM Claims 19 View
2001-05-11 ABST Abstract 1 View
2001-05-11 DRW Drawings-only black and white line drawings 7 View
2001-05-11 OATH Oath or Declaration filed 11 View
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Quick Facts
Patent No.
US 6,561,878
App. No.
09/854,282
Filed
2001-05-11
Granted
2003-05-13
Pub. No.
US20010018318A1
Art Unit
3725
PTA
-121 days