IP Library › Granted Patent US 6,670,267
Granted Patent Utility
US 6,670,267 · Confirmation No. 6406

FORMATION OF TUNGSTEN-BASED INTERCONNECT USING THIN PHYSICALLY VAPOR DEPOSITED TITANIUM NITRIDE LAYER

Inventor: Vincent Fortin
Patented Case View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2008-06-25 SOL.NTC.SUIT Report on the filing or determination of an action regarding a patent 3 View
2003-09-12 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-09-12 A... Amendment/Request for Reconsideration-After Non-Final Rejection 1 View
2003-09-12 REM Applicant Arguments/Remarks Made in an Amendment 2 View
2003-09-12 IDS Information Disclosure Statement (IDS) Form (SB08) 3 View
2001-06-13 TRNA Transmittal of New Application 1 View
2001-06-13 SPEC Specification 6 View
2001-06-13 CLM Claims 4 View
2001-06-13 ABST Abstract 1 View
2001-06-13 DRW Drawings-only black and white line drawings 4 View
2001-06-13 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,670,267
App. No.
09/881,607
Filed
2001-06-13
Granted
2003-12-30
Pub. No.
US20030001265A1
Examiner
TRAN, LONG K
Art Unit
2818
PTA
-111 days