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App. No. 09/893,104 · Confirmation No. 4877

Dielectric material and process of insulating a semiconductor device using same

Abandoned -- Failure to Respond to an Office Action View Publication ↗
⬇ PDF
 Code Description Pages PDF
2001-06-27 TRNA Transmittal of New Application 5 View
2001-06-27 SPEC Specification 9 View
2001-06-27 CLM Claims 4 View
2001-06-27 ABST Abstract 1 View
2001-06-27 DRW Drawings-only black and white line drawings 1 View
2001-06-27 OATH Oath or Declaration filed 3 View
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Quick Facts
App. No.
09/893,104
Filed
2001-06-27
Pub. No.
US20030008129A1
Examiner
VO, HAI
Art Unit
1771