PC adapter cards and method of manufacturing the same
View Patent ↗A method of manufacturing a mini-card with a semiconductor memory device includes the steps of (a) providing an array of substrates including a plurality of individual substrates; (b) mounting a semiconductor memory device on each of the individual substrates forming the substrate array; (c) covering the individual substrates with respective cases; and (d) dividing the substrate array to provide encased individual substrates each completing a mini-card having the semiconductor memory device embedded therein.
1. A method of manufacturing a mini-card with a semiconductor memory device comprising the steps of:
providing an array of substrates including a plurality of individual substrates separated from each other, and being interconnected only by one or more segments;
mounting a semiconductor memory device on each of the individual substrates;
covering the individual substrates with respective cases; and
dividing, after the step of covering is completed, the substrate array to provide encased individual substrates each completing the mini-card having the semiconductor memory device embedded therein.
2. The method of manufacturing a mini-card with a semiconductor memory device according to claim 1 , wherein, during the covering step, each substrate is sandwiched between top and bottom case segments.
3. The method of manufacturing a mini-card with a semiconductor memory device according to claim 1 , wherein, during the covering step, each substrate is molded into case.
4. A mini-card with a semiconductor memory device characterized in that the mini-card is manufactured by a method comprising the steps of:
providing an array of substrates including a plurality of individual substrates separated from each other, and being interconnected only by one or more segments;
mounting a semiconductor memory device on each of the individual substrates;
covering the individual substrates with respective cases; and
dividing, after the step of covering is completed, the substrate array to provide encased individual substrates each completing the mini-card having the semiconductor memory device embedded therein.