IP Library Granted Patent US 7,277,066
Granted Patent B2
US 7,277,066 · App. 09/906,342 · Granted Oct 2, 2007

Repairable tiled displays

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Quick Facts
Patent No.
US 7,277,066
App. No.
09/906,342
Granted
Oct 2, 2007
Kind
B2
Abstract

A tiled display may be formed by temporarily securing a plurality of modules to a substrate. Thereafter, the tiled array may be tested to insure that each module is functional. If each module is functional, the modules may be permanently secured to the substrate. If any modules are defective, they may be replaced and the tiled array may be retested.

Claims (30)

1. A method comprising:

securing a plurality of modules temporarily to a substrate to form a tiled display;

testing the tiled display having a plurality of temporarily secured modules;

removing any defective temporarily secured modules; and

permanently securing the tested modules to said substrate by injecting a permanent adhesive into the region between said modules and said substrate.

2. The method of claim 1 wherein securing a plurality of modules temporarily to a substrate includes providing a releasable adhesive between said modules and said substrate.

3. The method of claim 2 including providing a thermoplastic adhesive between said modules and said substrate.

4. The method of claim 2 including providing a pressure sensitive adhesive between said modules and said substrate.

5. The method of claim 1 including pre-attaching a releasable adhesive to said substrate before securing said substrate temporarily to said modules.

6. The method of claim 1 including injecting adhesive through said substrate into said region.

7. The method of claim 6 including injecting adhesive through a first central aperture and thereafter injecting adhesive through radially displaced apertures.

8. The method of claim 1 including spacing said modules from said substrate by securing a spacer to said substrate.

9. A tiled display comprising:

a substrate including a plurality of apertures for the injection of a filler material between said substrate and said modules; and

a plurality of display modules secured to said substrate by releasable adhesive.

10. The display of claim 9 including a plurality of radially spaced rings of apertures in said substrate for the injection of filler material into the region between the substrate and the modules.

11. The display of claim 9 wherein said releasable adhesive is a thermoplastic adhesive.

12. The display of claim 9 wherein said releasable adhesive is a pressure sensitive adhesive.

13. The display of claim 9 wherein said modules include organic light emitting material.

14. A method comprising:

securing a plurality of modules temporarily to a substrate to form a tiled display;

testing the tiled display having a plurality of temporarily secured modules;

removing any defective temporarily secured modules; and

progressively injecting adhesive between the substrate and the modules to permanently secure the modules to the substrate.

15. The method of claim 14 including providing a releasable adhesive between said modules and said substrate.

16. The method of claim 15 including providing a thermoplastic adhesive between said modules and said substrate and heating said adhesive to remove defective modules.

17. The method of claim 15 including providing a pressure sensitive adhesive between said modules and said substrate.

18. The method of claim 14 including injecting adhesive through said substrate into the region between said substrate and said modules.

19. The method of claim 18 including injecting adhesive through a central aperture and thereafter injecting adhesive through radially displaced apertures.

20. The method of claim 14 including spacing said modules from said substrate by securing a spacer to said substrate.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →