Granted Patent
Utility
US 6,575,352
· Confirmation No. 2773
APPARATUS AND METHOD FOR SOLDERING ELECTRONIC COMPONENTS TO PRINTED CIRCUIT BOARDS
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-07-24 | TRNA |
Transmittal of New Application | 2 | View | |
| 2001-07-24 | SPEC |
Specification | 13 | View | |
| 2001-07-24 | CLM |
Claims | 4 | View | |
| 2001-07-24 | ABST |
Abstract | 1 | View | |
| 2001-07-24 | DRW |
Drawings-only black and white line drawings | 4 | View | |
| 2001-07-24 | OATH |
Oath or Declaration filed | 3 | View |
Inventors
Kazushi Takahashi
Tokyo, JAPAN
Hiroshi Ohuchi
Tokyo, JAPAN
Attorneys & Agents of Record
Classification
USPC
228/223
Prosecution
- Examiner
- JOHNSON, JONATHAN J
- Art Unit
- 1725
- Customer No.
- 513
- Docket No.
- 2001_1033A
- Confirmation No.
- 2773
Foreign Priority
222565/2000
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2000-07-24
·
JAPAN
Publication
- Pub. No.
- US20020011511A1
- Pub. Date
- 2002-01-31
Patent Term Adjustment
0days
No related applications found.
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2001-07-24
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Quick Facts
- Patent No.
- US 6,575,352
- App. No.
- 09/910,905
- Filed
- 2001-07-24
- Granted
- 2003-06-10
- Pub. No.
- US20020011511A1
- Examiner
- JOHNSON, JONATHAN J
- Art Unit
- 1725
- PTA
- 0 days
External Links