Patent Assignment
Reel/Frame 012017/0894
Assignment of Assignor's Interest
Recorded: 2001-07-24
Pages: 3
Assignee
SENJU METAL INDUSTRY CO., LTD.
23, SENJU HASHIDO-CHO, ADACHI-KU, TOKYO, JAPAN
Covered Property
(1)
Apparatus and Method for Soldering Electronic Components to Printed Circuit Boards
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.