IP Library Granted Patent US 6,921,895
Granted Patent B1
US 6,921,895 · App. 09/914,083 · Granted Jul 26, 2005

Sensor module with integrated signal processing

Assignee: PerkinElmer Optoelectronics GmbH
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Quick Facts
Patent No.
US 6,921,895
App. No.
09/914,083
Granted
Jul 26, 2005
Kind
B1
Abstract

A sensor module comprises a radiation-sensitive sensor element ( 12 ), a sensor signal processing circuit ( 13, 41 a, 44 a ) receiving the output signal of the sensor element ( 12 ) and obtaining a radiation-dependent first electric signal therefrom, a temperature-sensitive reference means ( 14, 15, 41 b, 43, 44 b ) providing a temperature-dependent second electric signal and a signal combining means ( 16 ) for combining the two electric signals. The sensor signal processing circuit ( 13, 41 a, 44 a ), the reference means ( 14, 15, 41 b, 44 b ) and the combining means ( 16 ) are formed on a single chip ( 20, 21 ), and the chip ( 20, 21 ) and the sensor element ( 12 ) are accommodated in a common housing ( 22, 62, 64 ).

Claims (22)

1. Sensor module comprising

a radiation-sensitive sensor element providing a radiation-dependent electric output signal,

a sensor signal processing circuit receiving the output signal from the sensor element and providing a radiation-dependent first electric signal,

a temperature-sensitive reference means comprising a reference element thermally coupled to the sensor element and one or several squaring means connected to the reference element for simulating the temperature dependency of the photo-electric conversion characteristics of the sensor element and providing a temperature-dependent second electric signal, and

a combination means for combining the two electric signals, characterised in that

the sensor signal processing circuit, the temperature-sensitive reference means and the signal combining means are formed on a single, and

the chip and the sensor element are accommodated in a common housing.

2. Sensor module according to claim 1 , characterised in that the housing is provided with electrically conductive or semi-conductive walls.

3. Sensor module according to claim 1 , characterised in that the housing has a cylindrical shape and the cylinder has a diameter of less than 10 mm.

4. Sensor module according to claim 1 , characterised in that the sensor signal processing circuit is provided with a first amplifier.

5. Sensor module according to claim 1 , characterised in that the reference means comprises a reference element and a second amplifier.

6. Sensor module according to claim 1 , further comprising a compensation means for compensating the influence of the power dissipation of electronic components on the output signal.

7. Sensor module according to claim 1 , further comprising a radiation-transmissible window provided in the housing said window being electrically conductive or semi-conductive or having an electrically conductive or semi-conductive coating.

8. Sensor module according to claim 7 , further comprising an image element in the window of the housing.

9. Sensor module according to claim 1 , further comprising an optical imaging element provided in the housing.

10. Sensor module according to claim 9 , characterised in that the imaging element comprises a lens or a mirror.

11. Sensor module according to claim 1 , further comprising digital programming means provided in the housing for setting operating parameters of the sensor module.

12. Sensor module according to claim 1 , characterised in that the combination means is an integrator amplifier.

13. Sensor module according to claim 1 , characterised in that the combination means is a digital circuit receiving the signals from the sensor means and the reference means via A/D converters and outputting a digital, temporally serial signal.

14. Sensor module according to claim 1 , characterised in that the combination means is a digital circuit outputting digital signal as YES/NO values to be used for monitoring a temperature threshold or for controlling one or more temperatures to one or more target values, the one or more target values being programmable.

15. The sensor module of claim 1 wherein the reference means comprises elements for characteristics simulation, the elements simulating characteristics of the sensor element with an exponential function or a power function.

16. Sensor module according to claim 1 , characterised in that the combination means is a digital circuit outputting digital signal as YES/NO values to be used for monitoring a temperature threshold and for controlling one or more temperatures to one or more target values, the one or more target values being programmable.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 25, 2013
From: EXCELITAS TECHNOLOGIES GMBH & CO KG
To: EXCELITAS TECHNOLOGIES SINGAPORE PTE. LTD.
Reel/Frame 030076/0567 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2012
From: PERKINELMER TECHNOLOGIES GMBH & CO KG
To: EXCELITAS TECHNOLOGIES GMBH & CO KG
Reel/Frame 028080/0453 →
MERGER Recorded Nov 3, 2010
From: PERKINELMER GMBH & CO. KG; PERKINELMER OPTOELECTRONICS GMBH
To: PERKINELMER OPTOELECTRONICS GMBH & CO. KG
Reel/Frame 025238/0562 →
CHANGE OF NAME Recorded Oct 13, 2010
From: PERKINELMER OPTOELECTRONICS GMBH & CO. KG
To: PERKINELMER TECHNOLOGIES GMBH & CO. KG
Reel/Frame 025126/0697 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 20, 2002
From: SCHIEFERDECKER, JORG; SCHULZE, MISCHA
To: PERKINELMER OPTOELECTRONICS GMBH
Reel/Frame 012911/0265 →