Patent Application
Utility
App. No. 09/915,728
· Confirmation No. 6537
Semiconductor element, manufacturing method thereof and BGA-type semiconductor device
Inventor:
Rika Tanaka
Abandoned -- Failure to Respond to an Office Action
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-07-26 | TRNA |
Transmittal of New Application | 1 | View | |
| 2001-07-26 | SPEC |
Specification | 14 | View | |
| 2001-07-26 | CLM |
Claims | 4 | View | |
| 2001-07-26 | ABST |
Abstract | 1 | View | |
| 2001-07-26 | DRW |
Drawings-only black and white line drawings | 7 | View | |
| 2001-07-26 | OATH |
Oath or Declaration filed | 2 | View |
Inventors
Rika Tanaka
Tokyo, JAPAN
Attorneys & Agents of Record
Classification
USPC
257/734
H10W72/30
H10W72/856
H10W72/877
H10W72/354
H10W72/01255
H10W74/15
H10W72/073
H10W72/952
H10W72/072
H10W72/012
H10W72/90
H10W74/012
H10W72/20
H10W90/724
H10W90/734
H10W72/352
H10W76/60
H10W90/736
H10W72/251
H10W72/252
Prosecution
- Examiner
- NGUYEN, DILINH P
- Art Unit
- 2814
- Docket No.
- NEC 01FN021
- Confirmation No.
- 6537
Foreign Priority
2000-226347
·
2000-07-27
·
JAPAN
Publication
- Pub. No.
- US20020011664A1
- Pub. Date
- 2002-01-31
from
NEC CORPORATION
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2003-02-19
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Quick Facts
- App. No.
- 09/915,728
- Filed
- 2001-07-26
- Pub. No.
- US20020011664A1
- Examiner
- NGUYEN, DILINH P
- Art Unit
- 2814
External Links