Patent Application
Utility
App. No. 09/920,970
· Confirmation No. 6592
METHODS OF WAFER LEVEL FABRICATION AND ASSEMBLY OF CHIP SCALE PACKAGES
Inventor:
Warren M. Farnworth
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-08-02 | TRNA |
Transmittal of New Application | 2 | View | |
| 2001-08-02 | SPEC |
Specification | 11 | View | |
| 2001-08-02 | CLM |
Claims | 9 | View | |
| 2001-08-02 | ABST |
Abstract | 1 | View | |
| 2001-08-02 | DRW |
Drawings-only black and white line drawings | 5 | View | |
| 2001-08-02 | OATH |
Oath or Declaration filed | 1 | View |
Inventors
Warren M. Farnworth
Nampa, ID
Attorneys & Agents of Record
Classification
USPC
438/464
H10W72/0198
H10W70/099
H10W72/073
H10W72/01331
H10W70/635
H10W99/00
H10W72/9413
H10W74/111
H10W90/734
H10W70/09
Prosecution
- Examiner
- PERT, EVAN T
- Art Unit
- 2829
- Customer No.
- 24247
- Docket No.
- 3573.3US (97-1391.3)
- Confirmation No.
- 6592
Publication
- Pub. No.
- US20020001922A1
- Pub. Date
- 2002-01-03
Patent Term Adjustment
-37days
Parent
is a Continuation of
→
App. 09/388,033
· US 6,284,573
Filed 1999-09-01
· Patented Case
Parent
is a Continuation of
→
App. 09/082,745
· US 6,008,070
Filed 1998-05-21
· Patented Case
Child
is a Continuation of
→
App. 10/357,656
· US 6,787,394
Filed 2003-02-03
· Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2010-01-04
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Quick Facts
- App. No.
- 09/920,970
- Filed
- 2001-08-02
- Granted
- 2003-03-18
- Pub. No.
- US20020001922A1
- Examiner
- PERT, EVAN T
- Art Unit
- 2829
- PTA
- -37 days
External Links