Method and apparatus for probe tip cleaning and shaping pad
View Patent ↗A method and apparatus is provided for cleaning and shaping a probe tip using a multi-layer adhesive and abrasive pad. The multi-layer adhesive and abrasive pad is constructed on the surface of a support structure, such as a silicon wafer, and is made of an adhesive in contact with abrasive particles. Adhesive is applied in layers with abrasive particles in-between each layer of adhesive. Abrasive particles may vary in size and material from layer to layer to achieve cleaning, shaping and polishing objectives.
1. An apparatus for cleaning and shaping a probe tip comprising:
a support structure having a surface; and
a pad formed on said surface of said support structure, wherein said pad comprises a plurality of alternating layers of an adhesive layer and an abrasive layer, said plurality of alternating layers including at least two abrasive layers;
wherein each of said adhesive layer includes an adhesive and each of said abrasive layer includes a plurality of abrasive particles.
2. The apparatus of claim 1 wherein at least one of said abrasive layers comprises abrasive particles of a different size than the abrasive particles of another abrasive layer.
3. The apparatus of claim 2 wherein the size of the abrasive particles increases for each abrasive layer that is further from the support structure.
4. An apparatus for cleaning and shaping a probe tip comprising:
a support structure having a surface;
a pad formed on said surface of said support structure, wherein said pad comprises a plurality of composite layers, each of said composite layers including an adhesive and a plurality of abrasive particles in contact with said adhesive.
5. The apparatus of claim 4 wherein at least one of said composite layers comprises abrasive particles of a different size than the abrasive particles of another of said composite layers.
6. The apparatus of claim 5 wherein the size of said abrasive particles increases for each of said composite layers that is further from the support structure.
7. The apparatus of claim 4 wherein at least one of said composite layers comprises abrasive particles of a different material than the abrasive particles of another composite layer.
8. The apparatus of claim 4
wherein the support structure is a semiconductor wafer, wherein the adhesive is an acrylic adhesive, and wherein the abrasive particles are diamond particles.
9. A method for cleaning and shaping a probe tip comprising the steps of: inserting the probe tip into a multi-layered adhesive and abrasive particle pad, said pad including a plurality of abrasive layers including abrasive particles, said abrasive layers being separated by an adhesive material; and extracting the probe tip.
10. The method of claim 9 wherein the step of inserting the probe tip comprises inserting the probe tip a predetermined distance into the pad, wherein said predetermined distance is a function of tip length and pad thickness.
11. The method of claim 9 wherein the steps of inserting and extracting are performed on-line.
12. The method of claim 9 wherein at least one of said abrasive layers has abrasive particles having a different size than the abrasive particles of at least one other abrasive layer.
13. The method of claim 9 wherein at least one of said abrasive layers is a composite layers including an adhesive and abrasive particles having a different size than the abrasive particles of at least one other abrasive layer.
14. A method of making a probe tip cleaning and shaping pad comprising the steps of:
applying an adhesive layer to a support structure;
applying a plurality of abrasive particles to said adhesive layer to form an abrasive particle layer; and
heating the support structure,
wherein the step of applying said adhesive layer further comprises rolling the adhesive layer with a rolling tool to remove air bubbles; and
wherein the step of applying the plurality of abrasive particles comprises brushing the plurality of abrasive particles on to said adhesive layer.
15. A method of making a probe tip cleaning and shaping pad comprising the steps of:
applying an adhesive layer to a support structure;
applying a plurality of abrasive particles to said adhesive layer to form an abrasive particle layer; and
heating the support structure,
wherein the step of applying an adhesive layer further comprises placing the adhesive layer on the support structure and rolling over the adhesive layer with a rolling tool to remove air bubbles; and
wherein the step of applying the plurality of abrasive particles comprises brushing of abrasive particles on to said adhesive layer.
16. The method of claim 14 wherein in the step of applying the plurality of abrasive particles, said plurality of abrasive particles comprises varying grit sizes for different layers; and wherein said abrasive particles comprise diamond particles.
17. The method of claim 16 wherein the step of applying the plurality of abrasive particles further comprises graduating the size of the abrasive particles from smallest to largest with increasing distance of layers from the support structure.
18. The method of claim 17 wherein the step of applying the adhesive layer further comprises using an adhesive backing layer that can be peeled off, leaving the adhesive behind.