IP Library Assignment 017519/0082
Patent Assignment
Reel/Frame 017519/0082

Assignment of Assignor's Interest

Recorded: 2006-04-24 Pages: 10
Assignors
KULICKE AND SOFFA INDUSTRIES, INC.
Executed: 2006-03-03
K&S INTERCONNECT, INC.
Executed: 2006-03-03
Assignee
SV PROBE PTE LTD.
29 WOODLANDS INDUSTRIAL PARK E1, #04-01, NORTH TECH, LOBBY 1, SINGAPORE, 757716, SINGAPORE
Covered Properties (33)
Probe Card Apparatus
Patent: 5,521,518 →
Application: 07/775,914 →
Membrane Probe Contact Bump Compliancy System
Patent: 5,180,977 →
Application: 07/801,702 →
High Density Probe Card for Testing Electrical Circuits
Patent: 5,382,898 →
Application: 07/947,935 →
Bare Die Carrier
Patent: 5,402,077 →
Application: 07/979,719 →
Large Scale Protrusion Membrane for Semiconductor Devices Under Test with Very High Pin Counts
Patent: 5,422,574 →
Application: 08/004,447 →
Method for Making a Probe Preserving a Uniform Stress Distribution Under Deflection
Patent: 5,720,098 →
Application: 08/440,521 →
Bare Die Carrier
Patent: 6,049,215 →
Application: 08/542,685 →
Membrane for Holding a Probe Tip in Proper Location
Patent: 5,742,174 →
Application: 08/553,069 →
Rough Electrical Contact Surface
Patent: 5,876,580 →
Application: 08/586,232 →
Probe Card Apparatus
Patent: 6,037,785 →
Application: 08/652,942 →
Method and Circuit Testing Apparatus for Equalizing a Contact Force Between Probes and Pads
Patent: 5,644,249 →
Application: 08/659,861 →
Membrane Probing of Circuits
Patent: 5,847,571 →
Application: 08/675,416 →
Method and Apparatus for Aligning Probes
Patent: 5,751,157 →
Application: 08/681,226 →
Probe Card Assembly for High Density Integrated Circuits
Patent: 5,828,226 →
Application: 08/746,117 →
Exchangeable Membrane Probe Testing of Circuits
Patent: 5,841,291 →
Application: 08/764,511 →
Dual Contact Probe Assembly for Testing Integrated Circuits
Patent: 5,764,072 →
Application: 08/771,274 →
Assembly Structure for Making Integrated Circuit Chip Probe Cards
Patent: 5,884,395 →
Application: 08/835,078 →
Probe Assembly and Method for Switchable Multi-Dut Testing of Integrated Circuit Wafers
Patent: 5,923,178 →
Application: 08/837,399 →
Programmable High-Density Electronic Device Testing
Patent: 5,973,504 →
Application: 08/925,369 →
Assembly Structure for Making Integrated Circuit Chip Probe Cards
Patent: 6,204,674 →
Application: 08/962,595 →
High Temperature Probe Card for Testing Integrated Circuits
Patent: 6,064,215 →
Application: 09/057,080 →
Method and Apparatus for Interfacing Between Automatic Wafer Probe Machines, Automatic Testers, and Probe Cards
Patent: 6,114,869 →
Application: 09/082,896 →
Method for Making a Probe Apparatus for Testing Integrated Circuits
Patent: 6,419,500 →
Application: 09/264,599 →
Bare Die Carrier
Patent: 6,937,044 →
Application: 09/534,729 →
Method for Making a Probe Apparatus for Testing Integrated Circuits
Patent: 6,530,148 →
Application: 09/579,718 →
Probe Apparatus Having Removable Beam Probes
Patent: 6,424,164 →
Application: 09/593,262 →
Modulated Space Transformer for High Density Buckling Beam Probe and Method for Making the Same
Patent: 6,420,887 →
Application: 09/593,314 →
Interface Structure for Contacting Probe Beams
Patent: 6,570,396 →
Application: 09/721,910 →
Modular Probe Apparatus
Patent: 6,525,552 →
Application: 09/854,152 →
Publication: US 2002/0167328
Method and Apparatus for Probe Tip Cleaning and Shaping Pad
Patent: 6,908,364 →
Application: 09/921,327 →
Publication: US 2003/0027496
Prefabricated and Attached Interconnect Structure
Patent: 6,965,245 →
Application: 10/429,275 →
Publication: US 2004/0217768
Continuously Profiled Probe Beam
Patent: 510,043 →
Application: 29/183,540 →
Straight Protruding Probe Beam Contour Surfaces
Patent: 507,198 →
Application: 29/190,399 →
Related Assignments (17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 19, 1996
From: KISTER, JANUARY
To: PROBE TECHNOLOGY
Reel/Frame 008107/0836 →
Change of Name Jul 17, 2003
From: BLUELEAF, INC.
To: PICARRO, INC.
Reel/Frame 014289/0733 →
Assignment of Assignor's Interest Jan 24, 2005
From: PROBE TECHNOLOGY CORPORATION
To: K&S INTERCONNECT, INC.
Reel/Frame 016164/0639 →
Release of Security Interest Jan 27, 2006
From: BANK OF AMERICA, N. A.
To: CERPROBE CORPORATION
Reel/Frame 017073/0302 →
Assignment of Assignor's Interest Feb 6, 2006
From: KULICKE & SOFFA HOLDINGS, INC.
To: K&S INTERCONNECT, INC.
Reel/Frame 017125/0190 →
Assignment of Assignor's Interest Feb 6, 2006
From: KULICKE & SOFFA HOLDINGS, LLC
To: K&S INTERCONNECT, INC.
Reel/Frame 017125/0192 →
Assignment of Assignor's Interest Feb 6, 2006
From: KULICKE & SOFFA HOLDINGS, INC.
To: K&S INTERCONNECT, INC.
Reel/Frame 017125/0137 →
Assignment of Assignor's Interest Feb 6, 2006
From: KULICKE & SOFFA HOLDINGS, LLC
To: K&S INTERCONNECT, INC.
Reel/Frame 017125/0747 →
Merger Feb 6, 2006
From: PROBE TECHNOLOGY CORPORATION
To: K&S INTERCONNECT, INC.
Reel/Frame 017125/0042 →
Merger Feb 7, 2006
From: KULICKE & SOFFA INVESTMENTS, INC.; KULICKE & SOFFA INVESTMENT, INC.; KULICKE AND SOFFA INVESTMENTS, INC.
To: KULICKE AND SOFFA INDUSTRIES, INC.
Reel/Frame 017125/0490 →
Assignment of Assignor's Interest Feb 7, 2006
From: KULICKE & SOFFA HOLDINGS, LLC
To: K&S INTERCONNECT, INC.
Reel/Frame 017125/0628 →
Assignment of Assignor's Interest Feb 9, 2006
From: KULICKE AND SOFFA INDUSTRIES, INC.
To: K&S INTERCONNECT, INC.
Reel/Frame 017145/0395 →
Assignment of Assignor's Interest Feb 9, 2006
From: KULICKE & SOFFA HOLDINGS, LLC
To: K&S INTERCONNECT, INC.
Reel/Frame 017136/0995 →
Assignment of Assignor's Interest Feb 9, 2006
From: KULICKE & SOFFA HOLDINGS, INC.
To: K&S INTERCONNECT, INC.
Reel/Frame 017145/0387 →
Merger Feb 22, 2006
From: CERPROBE CORPORATION
To: K&S INTERCONNECT, INC.
Reel/Frame 017198/0487 →
Merger Mar 1, 2006
From: PROBE TECHNOLOGY CORPORATION
To: K&S INTERCONNECT, INC.
Reel/Frame 017230/0755 →
Merger Mar 3, 2006
From: CERPROBE CORPORATION
To: K&S INTERCONNECT, INC.
Reel/Frame 017240/0685 →