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App. No. 09/934,094 · Confirmation No. 7998

STACKED LEADS-OVER CHIP MULTI-CHIP MODULE

Inventor: Salman Akram
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2003-12-08 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-12-08 A.NA Amendment after Notice of Allowance (Rule 312) 5 View
2003-12-08 SPEC Specification 5 View
2003-12-08 CLM Claims 6 View
2003-12-08 REM Applicant Arguments/Remarks Made in an Amendment 4 View
2003-12-08 DRW Drawings-only black and white line drawings 3 View
2001-08-21 TRNA Transmittal of New Application 2 View
2001-08-21 SPEC Specification 11 View
2001-08-21 CLM Claims 4 View
2001-08-21 ABST Abstract 1 View
2001-08-21 DRW Drawings-only black and white line drawings 6 View
2001-08-21 OATH Oath or Declaration filed 2 View
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Quick Facts
App. No.
09/934,094
Filed
2001-08-21
Granted
2004-03-16
Pub. No.
US20030207495A1
Art Unit
2826
PTA
-118 days