IP Library Granted Patent US 6,390,910
Granted Patent Utility
US 6,390,910 · Confirmation No. 1065

METHOD AND APPARATUS FOR MECHANICAL AND CHEMICAL-MECHANICAL PLANARIZATION OF MICROELECTRONIC SUBSTRATES

Inventor: Scott E. Moore
⬇ PDF
Code Description Pages PDF
2001-08-29 TRNA Transmittal of New Application 3 View
2001-08-29 ADS Application Data Sheet 2 View
2001-08-29 A.PE Preliminary Amendment 2 View
2001-08-29 SPEC Specification 14 View
2001-08-29 CLM Claims 17 View
2001-08-29 ABST Abstract 1 View
2001-08-29 DRW Drawings-only black and white line drawings 6 View
2001-08-29 OATH Oath or Declaration filed 4 View
2001-08-29 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
Patent No.
US 6,390,910
App. No.
09/944,257
Filed
2001-08-29
Granted
2002-05-21
Pub. No.
US20020031984A1
Art Unit
3723
PTA
-57 days