Liquid crystal polymers for flexible circuits
A process for providing a metal-seeded liquid crystal polymer comprising the steps of providing a liquid crystal polymer substrate to be treated by applying an aqueous solution comprising an alkali metal hydroxide and a solubilizer as an etchant composition for the liquid crystal polymer substrate. Further treatment of the etched liquid crystal polymer substrate involves depositing an adherent metal layer on the etched liquid crystal polymer substrate. An adherent metal layer may be deposited using either electroless metal plating or vacuum deposition of metal such as by sputtering. When using electroless metal plating, a tin(II) solution applied to the liquid crystal polymer provides a treated liquid crystal polymer substrate to which the application of a palladium(II) solution provides the metal-seeded liquid crystal polymer. The etchant composition comprises a solution in water of from 35 wt. % to 55 wt. % of an alkali metal salt, and from 10 wt. % to 35 wt. % of a solubilizer dissolved in the solution to provide the etchant composition suitable for etching the liquid crystal polymer at a temperature from 50° C. to 120° C. A flexible circuit comprising a liquid crystal polymer film having through-holes and related shaped voids may be formed using etchant compositions as previously described.
1. A process for producing a metal-seeded liquid crystal polymer comprising the steps of:
providing a liquid crystal polymer substrate;
applying an aqueous solution comprising an alkali metal hydroxide and a solubilizer to said liquid crystal polymer substrate to provide an etched liquid crystal polymer substrate;
depositing an adherent metal layer on said etched liquid crystal polymer substrate.
2. The process of claim 1 , wherein said depositing an adherent metal layer uses electroless metal plating.
3. The process of claim 1 , wherein said depositing an adherent metal layer uses vacuum deposition of metal.
4. A process for producing a metal-seeded liquid crystal polymer comprising the steps of:
providing a liquid crystal polymer substrate;
applying an aqueous solution comprising an alkali metal hydroxide and a solubilizer to said liquid crystal polymer substrate to provide an etched liquid crystal polymer substrate;
applying a tin(II) solution to said etched liquid crystal polymer substrate to provide a treated liquid crystal polymer substrate; and
applying a palladium(II) solution to said treated liquid crystal polymer substrate to provide said metal-seeded liquid crystal polymer.
5. The process of claim 4 , wherein said alkali metal hydroxide is selected from the group consisting of sodium hydroxide and potassium hydroxide.
6. The process of claim 4 , wherein said solubilizer is selected from the group consisting of ethylene diamine, propylene diamine, ethanolamine and propanolamine.
7. The process of claim 4 , wherein said aqueous solution comprises from about 35 wt % to about 55 wt % of said alkali metal salt preferably from about 40 wt % to about 50 wt % of said alkali metal salt.
8. The process of claim 4 , wherein said aqueous solution comprises from about 10 wt % to about 35 wt % of said solubilizer preferably from about 15 wt % to about 30 wt % of said solubilizer.
9. The process of claim 4 , wherein said applying said aqueous solution requires a time from about 10 seconds to about 10 minutes at a temperature from about 50° C. to about 120° C., preferably about 70° to about 95° C.
10. A process for producing a metal-seeded liquid crystal polymer comprising the steps of:
providing a liquid crystal polymer substrate;
applying an aqueous solution comprising from about 40 wt % to about 50 wt % of potassium hydroxide and from about 10 wt % to about 35 wt % of ethanolamine to said liquid crystal polymer substrate to provide an etched liquid crystal polymer substrate;
applying a tin(II) solution to said etched liquid crystal polymer substrate to provide a treated liquid crystal polymer substrate; and
applying a palladium(II) solution to provide said metal-seeded liquid crystal polymer.
11. The process of claim 10 , wherein said applying said aqueous solution requires a time from about 10 seconds to about 10 minutes at a temperature from about 50° C. to about 120° C., preferably about 70° to about 95° C.
12. A process for producing an adhered metallic deposit on the surface of a metal-seeded liquid crystal polymer, said process comprising the steps of:
providing a liquid crystal polymer substrate;
applying an aqueous solution comprising an alkali metal hydroxide and a solubilizer to said liquid crystal polymer substrate to provide an etched liquid crystal polymer substrate;
applying a tin(II) solution to said etched liquid crystal polymer substrate to provide a treated liquid crystal polymer substrate; and
applying a palladium(II) solution to said treated liquid crystal polymer substrate to provide said metal-seeded liquid crystal polymer; and
depositing a metal layer on said metal-seeded liquid crystal polymer to produce said adhered metallic deposit thereon.
13. The process of claim 12 , wherein said alkali metal hydroxide is selected from the group consisting of sodium hydroxide and potassium hydroxide.
14. The process of claim 12 , wherein said solubilizer is selected from the group consisting of ethylene diamine, propylene diamine, ethanolamine and propanolamine.
15. A process for producing a metal-seeded liquid crystal polymer comprising the steps of:
providing a liquid crystal polymer substrate;
applying an aqueous solution comprising an alkali metal hydroxide and a solubilizer to said liquid crystal polymer substrate to provide an etched liquid crystal polymer substrate; and
applying a metal by vacuum deposition to said etched liquid crystal polymer substrate.
16. The process of claim 15 , wherein said alkali metal hydroxide is selected from the group consisting of sodium hydroxide and potassium hydroxide.
17. The process of claim 15 , wherein said solubilizer is selected from the group consisting of ethylene diamine, propylene diamine, ethanolamine and propanolamine.