Copper foil with low profile bond enhancement
View Patent ↗A composite material, comprising a carrier strip the carrier strip comprising a first side the first side comprising a substantially uniform roughness, an electrolytically deposited copper foil layer having opposing first and second sides and a thickness of from 0.1 micron to 15 microns and the entire metal foil layer thickness having been deposited from a copper containing alkaline electrolyte, and a release layer effective to facilitate separation of the metal foil layer from the carrier strip disposed between and contacting both the first side of the carrier strip and the second side of the metal foil layer.
1. A composite material, comprising:
a carrier strip said carrier strip comprising a first side said first side possessing a substantially uniform roughness wherein said substantially uniform roughness results from flashing said first side of said carrier strip with copper or nickel;
an electrolytically deposited copper foil layer having opposing first and second sides and a thickness of from 0.1 micron to 15 microns;
a dark layer effective to absorb light energy said dark layer having opposing first and second sides said first side of said dark layer in contact with said second side of said copper foil layer; wherein said dark layer has a thickness between 0.2 and 0.5 microns, said dark layer comprised of a material selected from the group consisting of copper, nickel, tin, manganese, iron, and copper-nickel alloys; and
a release layer effective to facilitate separation of said carrier strip from said dark layer disposed between and contacting both said first side of said carrier strip and said second side of said dark layer and effective to transmit the surface characteristics of said first side of said carrier strip to said second side of said dark layer.