Patent Assignment
Reel/Frame 039394/0201
Release of Security Interest Recorded at Reel/Frame 20143/0178
Recorded: 2016-07-19
Pages: 17
Assignor
Assignee
GLOBAL METALS, LLC
1901 N. ROSELLE ROAD, SUITE 800, SCHAUMBURG, ILLINOIS, 60195
Covered Properties
(79)
Treatment of Metal Foil
Patent:
4,961,828 →
Application:
07/333,212 →
Method of Treating Metal Foil to Improve Peel Strength
Patent:
5,071,520 →
Application:
07/428,683 →
Anti-Tarnish Treatment of Metal Foil
Patent:
5,057,193 →
Application:
07/453,370 →
Anti-Tarnish Treatment of Metal Foil
Patent:
5,164,235 →
Application:
07/489,158 →
Method and Composition for Depositing a Chromium-Zinc Anti-Tarnish Coating on Copper Foil
Patent:
5,022,968 →
Application:
07/585,832 →
Machinable Copper Alloys Having Reduced Lead Content
Patent:
5,137,685 →
Application:
07/662,876 →
A Chromium-Zinc Anti-Tarnish Coating on Copper Foil
Patent:
5,098,796 →
Application:
07/673,923 →
Chromium-Zinc Anti-Tarnish Coating for Copper Foil
Patent:
5,230,932 →
Application:
07/855,380 →
Machinable Copper Alloys Having Reduced Lead Content
Patent:
5,288,458 →
Application:
07/907,473 →
Chromium-Zinc Anti-Tarnish Coating for Copper Foil Having a Dark Color
Patent:
5,250,363 →
Application:
07/966,655 →
Copper Alloy Having High Strength and High Electrical Conductivity
Patent:
5,306,465 →
Application:
07/971,499 →
Metal Spray Forming Using Multiple Nozzles
Patent:
5,343,926 →
Application:
07/985,525 →
Lead Frames Having Achromium and Zinc Alloy Coating
Patent:
5,343,073 →
Application:
08/001,014 →
Vertical Casting Process
Patent:
5,381,847 →
Application:
08/074,189 →
Method for the Assembly of an Electronic Package
Patent:
5,540,378 →
Application:
08/126,862 →
Copper Alloy Having High Strength and High Electrical Conductivity
Patent:
5,370,840 →
Application:
08/135,760 →
Machinable Copper Alloys Having Reduced Lead Content
Patent:
5,409,552 →
Application:
08/155,680 →
Process for Improving the Bend Formability of Copper Alloys
Patent:
5,486,244 →
Application:
08/233,147 →
Lead Frames with Improved Adhesion to a Polymer
Patent:
5,449,951 →
Application:
08/270,064 →
Corrosion-Resistant Bismuth Brass
Patent:
5,637,160 →
Application:
08/277,928 →
A Method for the Manufacture of an Internally Enhanced Welded Tube
Patent:
5,494,209 →
Application:
08/300,001 →
Superficial Coating Layer for Electrical Conductors
Patent:
5,573,845 →
Application:
08/352,663 →
Copper Alloy Clad for Coinage
Patent:
5,472,796 →
Application:
08/372,272 →
Copper Base Alloys Having Improved Bend Formability
Patent:
5,565,045 →
Application:
08/432,566 →
Process for Improving the Bend Formability of Copper Alloys
Patent:
5,601,665 →
Application:
08/436,894 →
Internally and Externally Enhanced Welded Tube
Patent:
5,730,189 →
Application:
08/449,173 →
Copper Alloy Foils for Flexible Circuits
Patent:
5,681,662 →
Application:
08/529,265 →
Iron Modified Phosphor-Bronze
Patent:
5,882,442 →
Application:
08/591,065 →
Tin Coated Electrical Connector
Patent:
5,780,172 →
Application:
08/657,211 →
Water-Based Urethane Adhesive
Patent:
5,688,356 →
Application:
08/744,288 →
Copper Alloy and Process for Obtaining Same
Patent:
5,865,910 →
Application:
08/747,014 →
Tin Coated Electrical Connector
Patent:
5,916,695 →
Application:
08/769,912 →
Copper Alloy and Process for Obtaining Same
Patent:
5,820,701 →
Application:
08/780,116 →
Heat Exchange Tube with Embossed Enhancement
Patent:
6,067,712 →
Application:
08/814,163 →
Iron Modified Tin Brass
Patent:
5,853,505 →
Application:
08/844,478 →
Multi-Layer Diffusion Barrier for a Tin Coated Electrical Connector
Patent:
6,083,633 →
Application:
08/877,020 →
Nodular Copper/Nickel Alloy Treatment for Copper Foil
Patent:
5,800,930 →
Application:
08/879,689 →
Copper Alloy Having Improved Stress Relaxation
Patent:
5,868,877 →
Application:
08/898,053 →
Copper Alloy with Magnesium Addition
Patent:
5,980,656 →
Application:
08/898,694 →
Copper Alloy and Process for Obtaining Same
Patent:
5,893,953 →
Application:
08/931,696 →
Tin Coatings Incorporating Selected Elemental Additions to Reduce Discoloration
Patent:
6,136,460 →
Application:
09/054,899 →
Copper Alloy Having Improved Stress Relaxation
Patent:
6,093,265 →
Application:
09/099,297 →
Iron Modified Tin Brass
Patent:
6,132,528 →
Application:
09/103,681 →
Copper Alloy and Process for Obtaining Same
Patent:
6,099,663 →
Application:
09/103,866 →
Copper Alloy and Process for Obtaining Same
Patent:
5,916,386 →
Application:
09/123,710 →
Copper Alloy and Process for Obtaining Same
Patent:
5,985,055 →
Application:
09/132,440 →
Enhanced Heat Exchange Tube
Patent:
6,164,370 →
Application:
09/160,029 →
Tin Coatings Incorporating Selected Elemental Additions to Reduce Discoloration
Patent:
6,183,886 →
Application:
09/213,545 →
Copper Alloy Having Improved Resistance to Cracking Due to Localized Stress
Patent:
6,251,199 →
Application:
09/304,803 →
Copper Alloy and Process for Obtaining Same
Patent:
6,436,206 →
Application:
09/311,038 →
Copper Alloy
Patent:
6,241,831 →
Application:
09/325,036 →
Tintable Water-Based Coating Composition
Patent:
6,194,513 →
Application:
09/400,771 →
Stress Relaxation Resistant Brass
Patent:
6,471,792 →
Application:
09/429,871 →
Copper foil composite including a release layer
Patent:
6,346,335 →
Application:
09/522,544 →
Copper Alloy and Process for Obtaining Same
Patent:
6,695,934 →
Application:
09/527,144 →
Copper Alloy with a Golden Visual Appearance
Patent:
6,432,556 →
Application:
09/561,110 →
Tintable water-based coating composition
Patent:
6,348,544 →
Application:
09/568,375 →
Copper Foil with Low Profile Bond Enhancement
Copper Alloy
Process for Making Copper-Tin-Zinc Alloys
Copper Foil Composite Including a Release Layer
Copper Alloy Having Improved Stress Relaxation Resistance
Water-Based Adhesive
Silver Containing Copper Alloy
Copper Foil with Low Profile Bond Enhancement
Bond Enhancement Antitarnish Coatings
Copper Alloy Containing Cobalt, Nickel and Silicon
Chromium-Free Antitarnish Adhesion Promoting Treatment Composition
Age-hardening copper-base alloy and processing
Application:
10/657,005 →
Publication:
US 2004/0166017
Peel Strength Enhancement of Copper Laminates
Silver containing copper alloy
Application:
10/782,019 →
Publication:
US 2004/0159379
Tarnish Deterring Tin Coating
Fretting and Whisker Resistant Coating System and Method
Support Layer for Thin Copper Foil
Copper Alloy Containing Cobalt, Nickel and Silicon
Copper alloy containing cobalt, nickel and silicon
Laser ablation resistant copper foil
Application:
11/592,943 →
Publication:
US 2007/0111016
Method for Manufacturing a Composite Material Including Copper Foil and Support Layer
Copper Tin Nickel Phosphorus Alloys With Improved Strength and Formability and Method of Making Same
Application:
60/979,064 →
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest in Patents
Jun 1, 2012
From: GOLDMAN SACHS LENDING PARTNERS LLC
To: GBC METALS, LLC; GLOBAL BRASS AND COPPER, INC.
Reel/Frame 028300/0731 →
Patent Security Agreement
Jun 1, 2012
From: GBC METALS, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 028300/0834 →
Release of Security Interest Recorded at Reel/Frame 24990/0283
Jul 19, 2016
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS AGENT, SUCCESSOR BY MERGER TO WACHOVIA BANK, NATIONAL ASSOCIATION, AS AGENT
To: GBC METALS, LLC
Reel/Frame 039394/0103 →
Security Interest
Jul 19, 2016
From: GBC METALS, LLC (F/K/A GLOBAL METALS, LLC)
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 039394/0160 →
Security Interest (Term Loan)
Jul 19, 2016
From: GBC METALS, LLC (F/K/A GLOBAL METALS, LLC)
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 039394/0189 →
Release of Security Interest Recorded at Reel/Frame 28300/0834
Jul 19, 2016
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS AGENT
To: GBC METALS, LLC (FORMERLY GLOBAL METALS, LLC)
Reel/Frame 039394/0259 →