Copper alloy containing cobalt, nickel and silicon
View Patent ↗A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up 1% of silver. A process to manufacture the alloys of the invention as well as other copper-nickel-silicon alloys includes the sequential steps of (a). casting the copper alloy; (b). hot working the cast copper-base alloy to effect a first reduction in cross-sectional area; (c). solutionizing the cast copper-base alloy at a temperature and for a time effective to substantially form a single phase alloy; (d). first age annealing the alloy at a temperature and for a time effective to precipitate an amount of a second phase effective to form a multi-phase alloy having silicides; (e). cold working the multi-phase alloy to effect a second reduction in cross-sectional area; and (f). second age annealing the multiphase alloy at a temperature and for a time effective to precipitate additional silicides thereby raising conductivity, wherein the second age annealing temperature is less than the first age annealing temperature.
1. A process for the manufacture of a copper-base alloy, comprising the sequential steps of: a). casting said copper-base alloy containing, by weight, from 0.5% to 5.0% nickel and 0.1% to 1.5% silicon; b). hot working said cast copper-base alloy to effect a first reduction in cross-sectional area; c). solutionizing said cast copper-base alloy at a solutionizing temperature and for a first time effective to substantially form a single phase alloy; d). without any intervening cold work following said solutionizing, first age annealing said substantially single phase alloy at a first age anneal temperature and for a second time effective to precipitate a second phase; e). cold working said multi-phase alloy to effect a second reduction in cross-sectional area; and f). second age annealing said multiphase alloy at a second age anneal temperature and for a third time effective to precipitate an additional amount of said second phase, wherein said second age anneal temperature is less than said first age anneal temperature.
2. The process of claim 1 wherein following said solutionizing step, an average grain size of said wrought copper alloy is 20 microns or less.
3. The process of claim 1 including a step of cold working said wrought copper alloy between said hot working step (b) and said solutionizing step (c).
4. A process for the manufacture of a copper-base alloy, comprising the sequential steps of: a). casting said copper-base alloy containing, by weight, from 0.5% to 5.0% nickel and 0.1% to 1.5% silicon; b). hot working said cast copper-base alloy to effect a first reduction in cross-sectional area; c). solutionizing said cast copper-base alloy at a solutionizing temperature and for a first time effective to substantially form a single phase alloy; d). without any intervening cold work following said solutionizing, first annealing said substantially single phase alloy at a first anneal temperature and for a second time effective to precipitate a second phase; e). cold working said multi-phase alloy to effect a second reduction in cross-sectional area; and f). second annealing said multiphase alloy at a second anneal temperature and for a third time, wherein said second anneal temperature is less than said first anneal temperature.
5. The process of claim 4 wherein following said solutionizing step, an average grain size of said wrought copper alloy is 20 microns or less.
6. The process of claim 4 including a step of cold working said wrought copper alloy between said hot working step (b) and said solutionizing step (c).
7. The process of claim 6 wherein both said hot working step and said cold working steps constitute rolling and said wrought copper alloy is formed into a strip.
8. A process for the manufacture of a copper-base alloy, comprising the sequential steps of: a). casting said copper-base alloy containing, by weight, from 0.5% to 5.0% nickel and 0.1% to 1.5% silicon; b). hot working said cast copper-base alloy in one or more passes to form a hot worked product; c). solutionizing said hot worked product at a temperature in excess of from 800° C. to a solidus temperature of said copper-base alloy; d). without any intervening cold work following said solutionizing, first annealing said hot worked plate at a temperature of from 350° C. to 600° C. for from 30 minutes to 30 hours; e). cold working said hot worked plate to a reduction in cross-sectional area to form a product; and f). second annealing said product at a temperature less than said first precipitation annealing temperature.
9. The process of claim 8 wherein said hot working is at a temperature of between 850° C. and 1000° C. and said solutionizing temperature of between 800° C. and 1000° C.
10. The process of claim 9 further including a step of quenching said copper base alloy following said hot working step (b).
11. The process of claim 10 wherein said first anneal is at a temperature of between 475° C. and 550° C. and said second anneal temperature is between 350° C. and 500° C.
12. The process of claim 11 further including a step of cold working said copper alloy to a gauge effective for solutionizing between said quench and said solutionizing step (c).
13. The process of claim 12 wherein said hot working step and said cold working steps both constitute rolling thereby forming said copper alloy into a strip.
14. The process of claim 12 wherein said copper alloy is selected to have a composition of from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si being between 2:1 and 7:1 and the balance copper and inevitable impurities.
15. The process of claim 12 wherein said copper alloy is selected to have a composition of from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si being between 2:1 and 7:1, from an amount effective to improve a combination of yield strength and electrical conductivity up to 1.0% of silver, titanium, zirconium and combinations thereof, up to 0.15% of magnesium and the balance copper and inevitable impurities.
16. The process of claim 12 wherein said copper alloy is selected to have a composition of 2.2%-4.2% nickel, 0.25%-1.2% silicon, 0.05%-0.30% magnesium and the balance copper.