Patent Assignment
Reel/Frame 024946/0656
Security Agreement
Recorded: 2010-09-07
Received: 2010-09-07
Pages: 13
Assignor
GBC METALS, LLC
Executed: 2010-08-18
Assignee
GOLDMAN SACHS LENDING PARTNERS LLC, AS COLLATERAL AGENT
30 HUDSON STREET, 36TH FLOOR, JERSEY CITY, NJ, 07302, UNITED STATES
Covered Properties
(22)
Antitarnish, Antimicrobial Copper Alloys and Surfaces Made from Such Alloys
Application:
61/259,837 →
Copper-Nickel-Silicon Alloys
Application:
12/336,731 →
Copper Tin Nickel Phosphorus Alloys With Improved Strength and Formability and Method of Making Same
Application:
12/249,530 →
Fretting and Whisker Resistant Coating System and Method
Application:
12/145,420 →
Method for Manufacturing a Composite Material Including Copper Foil and Support Layer
Application:
11/593,949 →
Copper alloy containing cobalt, nickel and silicon
Application:
11/588,111 →
Copper Alloy Containing Cobalt, Nickel and Silicon
Application:
11/246,966 →
Support Layer for Thin Copper Foil
Application:
10/965,347 →
Fretting and Whisker Resistant Coating System and Method
Application:
10/962,917 →
Tarnish Deterring Tin Coating
Application:
10/930,316 →
Peel Strength Enhancement of Copper Laminates
Application:
10/727,920 →
Chromium-Free Antitarnish Adhesion Promoting Treatment Composition
Application:
10/653,582 →
Copper Alloy Containing Cobalt, Nickel and Silicon
Application:
10/610,433 →
Bond Enhancement Antitarnish Coatings
Application:
10/017,863 →
Copper Foil with Low Profile Bond Enhancement
Application:
09/948,166 →
Silver Containing Copper Alloy
Application:
09/923,137 →
Water-Based Adhesive
Application:
09/907,224 →
Copper Alloy Having Improved Stress Relaxation Resistance
Application:
09/879,616 →
Copper Foil Composite Including a Release Layer
Application:
09/842,454 →
Process for Making Copper-Tin-Zinc Alloys
Application:
09/808,337 →
Copper Alloy
Application:
09/800,989 →
Copper Foil with Low Profile Bond Enhancement
Application:
09/784,547 →