IP Library Granted Patent US 6,569,543
Granted Patent Utility
US 6,569,543 · Confirmation No. 3247

COPPER FOIL WITH LOW PROFILE BOND ENHANCEMENT

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Code Description Pages PDF
2001-02-15 TRNA Transmittal of New Application 3 View
2001-02-15 SPEC Specification 29 View
2001-02-15 CLM Claims 5 View
2001-02-15 ABST Abstract 1 View
2001-02-15 DRW Drawings-only black and white line drawings 7 View
2001-02-15 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,569,543
App. No.
09/784,547
Filed
2001-02-15
Granted
2003-05-27
Pub. No.
US20020160219A1
Art Unit
1775
PTA
-20 days